AM79212JC AMD (ADVANCED MICRO DEVICES), AM79212JC Datasheet - Page 15

• Manufacturer Part Number: AM79212JC
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of AM79212JC

• Lead Free Status / RoHS Status: Supplier Unconfirmed

ABSOLUTE MAXIMUM ELECTRICAL
AND THERMAL RATINGS
ASLIC Device
Storage temperature .................. –55°C
Ambient temperature,
Ambient relative humidity
V
V
V
BGND with respect to
Voltage on relay outputs .......................................+7 V
AD or BD to BGND:
Current into SA or SB: 10 µs rise to Ipeak;
Current into SA or SB: 2 µs rise to Ipeak;
Current through AD or BD..............................±150 mA
C5–C1
Maximum power dissipation, T
Note: Thermal limiting circuitry on chip will shut down the
circuit at a junction temperature of about 160°C. The device
should never be exposed to this temperature. Operation
above 145°C junction temperature may degrade device
reliability. See the SLIC Packaging Considerations for more
information.
CC
BAT
CC
under Bias............................... –40°C
(noncondensing) ..................................... 5 to 100%
AGND/DGND ................................ –0.5 V to +0.5 V
Continuous..................................... –75 V to +1.0 V
10 ms (f = 0.1 Hz) ............................. –75 V to +5 V
1 µs (f = 0.1 Hz) .............................. –90 V to +10 V
250 ns (f = 0.1 Hz) ........................ –120 V to +15 V
1000 µs fall to 0.5 Ipeak;
2000 µs fall to I = 0 ..........................Ipeak = ±5 mA
10 µs fall to 0.5 Ipeak;
20 µs fall to I = 0 .........................Ipeak = ±12.5 mA
to DGND or AGND................–0.4 V to V
with respect to AGND/DGND ........ –0.4 V to +7 V
with respect to V
with respect to BGND ................ +0.4 V to –75 V
BAT
....................................+80 V
A
= 70°C ...........1.67 W
T
T
A
P R E L I M I N A R Y
CC
ASLIC/ASLAC Products
A
+150
+ 0.4 V
+85°C
°
C
ASLAC Device
Storage temperature...................–60°C
Ambient temperature,
Ambient relative humidity
V
V
V
AGND .....................................................DGND ±0.4 V
Latch up immunity (any pin) .......................... ±100 mA
Any other pin with
Stresses above those listed under Absolute Maximum Ratings
may cause permanent device failure. Functionality at or above
these limits is not implied. Exposure to Absolute Maximum
Ratings for extended periods may affect device reliability.
OPERATING RANGES
Environmental
Ambient temperature ......... 0°C to +70°C Commercial*
Ambient relative humidity ......................... 15% to 85%
ASLIC Device
V
V
BGND with respect to GND ........ –100 mV to +100 mV
Load resistance on V
ASLAC Device
Supplies V
DGND ..................................................................... 0 V
AGND
Operating ranges define those limits over which the
functionality of the device is guaranteed by production
testing.
* Functionality of the device from 0°C to +70°C is guaranteed
by production testing. Performance from –40°C to +85°C is
guaranteed by characterization and periodic sampling of
production units.
CCA
CCA
IN
CC
BAT
under Bias ...............................–40°C
(noncondensing)......................................5 to 100%
respect to DGND ................. –0.4 V to VCC + 0.4 V
with respect to DGND ....... –0.4 V to V
.............................................................. +5 V ± 5%
, V
..................................................... –18 V to –70 V
with respect to V
CCD
CCA
DGND ± 50 mV
with respect to DGND....... –0.4 V to + 6 V
, V
CCD
TX
................................ +5.0 V ± 5%
CCD
to ground............... 10 k
................................ ±0.4 V
T
CCA
T
A
A
+125°C
+ 0.4 V
+85°C
min
15