HY82563EB Intel, HY82563EB Datasheet - Page 43

• Manufacturer Part Number: HY82563EB
• Manufacturer: Intel

Specifications of HY82563EB

• Lead Free Status / RoHS Status: Compliant

5.0
5.1
Figure 11. Mechanical Information
Package Information
Package and Pinout Information
This section describes the 82563EB/82564EB device physical characteristics. The pin number-to-
signal mapping is indicated beginning with
The package used for the 82563EB/82564EB is a 100-pin, 14 mm x 14 mm TQFL with an
Exposed-Pad*. An Exposed-Pad* is a central pad on the bottom of the package that serves as a
ground and thermal connection.
82563EB/82564EB Gigabit Platform LAN Connect Networking Silicon
Section
5.3.
37