73M2901CE-IGV TDK Corporation, 73M2901CE-IGV Datasheet

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73M2901CE-IGV

Manufacturer Part Number
73M2901CE-IGV
Description
Manufacturer
TDK Corporation
Datasheet

Specifications of 73M2901CE-IGV

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DESCRIPTION
The 73M2901CE low speed modem integrates a
data pump, controller, and analog front end in a 3.3V
device with a powerful "AT" command host
interface. The modem reduces external component
count/cost by incorporating many features like
parallel phone detect, Line-In-Use and Ring
detection in software without additional components
required.
The device is a "one chip fits all” solution for
applications including set-top boxes, point-of-sale
terminals, automatic teller machines, utility meters,
vending machines and smart card readers.
Another distinctive feature of this device is pin
compatibility with TDK’s flagship embedded hard
modems, the 73M2901CL, and the 73M1903 soft
modem AFE. This offers customers a cost effective
method to design for both hard or soft modem
solutions in the same system as a risk-free cost
reduction path.
Complete Support and Modem Reference Designs
Error correction software and support are part of the
solution offered by TDK Semiconductor. Our in-
house application engineering team is here to help
you meet your international certification needs.
BLOCK DIAGRAM
2004 TDK Semiconductor Corporation
1
FEATURES
True one chip solution for embedded systems
As low as 9.5mA operating with standby and
power down mode available
Power supply operation from 3.6V to 2.7V
Data speed:
V.22bis – 2400bps
V.22/Bell212 – 1200bps
V.21/Bell103 – 300bps
V.23 – 1200/75bps (with PAVI turnaround)
Bell202 – 1200bps
Bell202/V23 4-wire operation
International Call Progress support
FCC68, CTR21, JATE, etc.
Worldwide Caller ID capability
Type I and II support
EIA 777 compliant
DTMF generation and detection
SMS messaging support
On chip hybrid driver
Blacklisting capability
Line-In-Use and Parallel Pick-Up (911) detection
with voltage or low cost energy detection method
Incoming ring energy detection through CID path;
no optocoupler required
Manufacturing Self Test capability
Backward compatible with 73M2901CL
Packaging:
32 lead QFN
32 pin TQFP packages
V.22bis Single Chip Modem
73M2901CE
04/15/04- V2.2.1
APRIL 2004

Related parts for 73M2901CE-IGV

73M2901CE-IGV Summary of contents

Page 1

... DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3V device with a powerful "AT" command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection in software without additional components required. The device is a " ...

Page 2

... Normal operation is resumed when an interruption such as assertion of DTR or RING, a supports character is sent to the 73M2901CE TXD input reset occurs. ANALOG LINE / HYBRID INTERFACE The 73M2901CE provides a differential analog output (TXAP and TXAN) and a single-ended analog input (RXA) with internal A/D and D/A converters ...

Page 3

... The signals DCD, CTS and DSR will be held inactive for 25ms, acknowledging the reset operation, within a 250ms time window after the reset -triggering event. The 73M2901CE is ready for operation after the 250ms window and/or after the signals DCD, CTS and DSR become active. ...

Page 4

... V.22bis Single Chip Modem DIGITAL INTERFACE PIN DESCRIPTION PIN PIN TYPE DESCRIPTION NAME RESET 9 I Reset Receive data synchronous clock valid on rising RXCLK 27 O edge Transmit data synchronous clock valid on rising TXCLK 24 O edge TXD 23 I Serial data input from DTE ...

Page 5

... VPD + 0.5V -55ºC to 150ºC RATING 2.7V – 3.6V 11.0592MHz +/- 50ppm -40ºC to 85ºC MIN -43 -48 -43 150 18.8 0.587 nd rd and 3 harmonic 2 ; dBm=10log(V /(1mW)(600 )) rms rms 5 73M2901CE NOM MAX UNIT * dBm0 * dBm0 dBm0 -70 - 19.3 19.8 dB 0.622 0.658 Vpk -70 ...

Page 6

... V.22bis Single Chip Modem TRANSMITTER PARAMETER CONDITIONS 550Hz (relative to carrier) ITU Guard tone power 1800Hz (relative to carrier) Calling Tone 1300Hz Answer Tone power 2225Hz/2100Hz High band tones DTMF Transmit power Low band tones Gain adjust tolerance By step 1KHz sine wave at output ...

Page 7

... MIN Vdd=3.3V 1.19 Vdd=3.3V 1.19 Vdd=3.3V, steady state SYMBOL CONDITIONS MIN IDD1 30pF/pin IDD2 30pF/pin IDD3 30pF/pin SYMBOL CONDITIONS MIN IDD1 30pF/pin IDD2 30pF/pin IDD3 30pF/pin 7 73M2901CE NOM MAX UNIT 0.8 V 0.2Vdd V +5.5 V Vdd+0.5 V 0. NOM MAX UNIT 1.25 1. ...

Page 8

... V.22bis Single Chip Modem DC SUPPLY CURRENT VDD = 3.3V PARAMETER Maximum Power supply, normal operation Maximum power supply Idle mode Maximum power supply Power down mode DC SUPPLY CURRENT VDD = 3.6V PARAMETER Maximum Power supply, normal operation Maximum power supply Idle mode ...

Page 9

... The host can also program the modem to power down via external pin (DTR) or via a firmware command. * Refer to the TDK 73M2901CE User Guide for a complete description of the software. 2004 TDK Semiconductor Corporation V.22bis Single Chip Modem FIRMWARE FEATURES “ ...

Page 10

... The TDK 73M2901CE is an enhanced version of the TDK 73M2901CL and has a number of new features. These parts are highly compatible with the * (refer to the TDK 73M2901CE User Guide for complete details) 2004 TDK Semiconductor Corporation earlier 73M2901 however special attention should be paid when changing an existing 73M2901 design to use the 73M2901CE or 73M2901CL ...

Page 11

... The SNR is held constant at the indicated values as the Receive level is lowered from a very high to a very low signal level. The width of the bowl of these curves, taken at the BER break points is the measure of the dynamic range. variation in 11 73M2901CE 04/15/04- V2.2.1 ...

Page 12

... V.22bis Single Chip Modem LOW COST DESIGN USING DSP RING AND STATUS MONITORING C2 VCC3_3D C11 + C12 27pF 0.1uF 10uF TXD U1 73M2901CE 25 VPD RXD 26 RXD 27 RXCLK DTRB 28 DTR 29 USR20 30 RING 31 RELAY RIB 32 RI DCDB DSRB CTSB RTSB T1 Sumida MIT4115 3 2 HYBRID1 ...

Page 13

... VREF 12 TXAP 11 TXAN 10 VPA 9 RESET 0.1uF 0.1uF VCC3_3D C 1 10uF 10K + 10uF 0.1uF Modem and Hybrid Circuitry 13 73M2901CE R17 475 HYBRID1 R15 5. .01UF R 2 R13 20K 21K HYBRID2 VCC3_3D VCC3_3A + C 9 C10 R20 27K 22uF 0.1uF DETECT R18 100 LIUCHK R16 100 HOOKB 04/15/04- V2 ...

Page 14

... V.22bis Single Chip Modem T1 Sumida MIT4114 3 2 HYBRID1 D 1 15V 0. HYBRID2 DETECT U 2 TLP627 VCC3_3D U 3 TLP627 LIUCHK VCC3_3D U 4 TLP627 HOOKB DAA Circuit Showing Hardware Detection Circuitry 2004 TDK Semiconductor Corporation 13K 13K R 3 33K PPU Circuit CMPT6429 + C15 ...

Page 15

... BER CURVES 2004 TDK Semiconductor Corporation V.22bis Single Chip Modem BER vs. SNR BER vs. Receive Level 15 73M2901CE 04/15/04- V2.2.1 ...

Page 16

... V.22bis Single Chip Modem 2004 TDK Semiconductor Corporation 16 04/15/04- V2.2.1 ...

Page 17

... OSCOUT USR10 8 18 VND 17 17 73M2901CE NAME PIN NAME VND VPD 25 OSCOUT RXD 26 OSCIN RXCLK 27 VPD DTR 28 NC USR20 29 VND RING 30 TXD RELAY 31 TXCLK TXCLK 23 TXD 22 VND 21 NC TDK 73M2901CE 20 VPD OSCIN 19 OSCOUT 18 17 VND 32-Pin TQFP 73M2901CE -IGV 04/15/04- V2.2.1 ...

Page 18

... NOM./ 0.7MAX. 0.00 / 0.005 SIDE VIEW 0.20 REF. SEATING PLANE All Dimensions in mm 2.95 / 3.25 0.18 / 0.3 1.475 / 1.625 0.5 BOTTOM VIEW TOP VIEW 32 Pin QFN 73M2901CE -IM 32 Pin TQFP 73M2901CE -IGV 18 0.85 NOM. / 0.9MAX. 5 4.75 2.5 2.375 04/15/04- V2.2.1 ...

Page 19

... TSC assumes no liability for applications assistance. TDK Semiconductor Corp., 6440 Oak Canyon, Irvine, CA 92618-5201 TEL (949) 508-8800, FAX (949) 508-8877, http://www.tdksemiconductor.com 2004 TDK Semiconductor Corporation V.22bis Single Chip Modem ORDER NUMBER PACKAGING MARK 73M2901CE-IM 73M2901CEIM 73M2901CE-IM/F 73M2901CEIM/F 73M2901CE-IGV 73M2901CEIGV 73M2901CE-IGV/F 73M2901CEIGV/F 19 73M2901CE 04/15/04- V2.2.1 ...

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