PC82573L Intel, PC82573L Datasheet - Page 30

• Manufacturer Part Number: PC82573L
• Manufacturer: Intel

Specifications of PC82573L

• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 196
• Lead Free Status / RoHS Status: Compliant

Table 20.
4.0
4.1
Figure 6.
30
NVM Interface Timing Specifications for EEPROM (Sheet 2 of 2)
1. 50% duty cycle.
Package and Pinout Information
This section describes the 82573 physical characteristics and pin-to-signal mapping.
Package Information
The 82573 device is a lead-free 196-pin thin and Fine Pitch Ball Grid Array (TF-BGA)
measuring 15 mm by 15 mm. The nominal ball pitch is 1.0 mm.
82573 Controller TF-BGA Package Ball Pad Dimensions
t
t
t
HO
DIS
WC
Symbol
Output hold
time
Output disable
time
Write cycle time
Parameter
0.4 mm
Solder Resist Opening
0.55 mm
Metal Diameter
Min
0
Detail Area
Typ
Max
250
10
82573—Datasheet
Units
ms
ns
ns