LAN91C111I-NC Standard Microsystems (SMSC), LAN91C111I-NC Datasheet - Page 6
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LAN91C111I-NC
Manufacturer Part Number
LAN91C111I-NC
Description
Manufacturer
Standard Microsystems (SMSC)
Datasheet
1.LAN91C111I-NC.pdf
(6 pages)
Specifications of LAN91C111I-NC
Lead Free Status / RoHS Status
Supplier Unconfirmed
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LAN91C111I-NC
Manufacturer:
TI
Quantity:
2
Company:
Part Number:
LAN91C111I-NC
Manufacturer:
SMSC
Quantity:
452
Revision 1.91 (08-18-08)
D/2
E/2
ccc
ccc
A1
A2
E1
R1
R2
L1
W
D1
A
D
E
H
L
e
q
Notes:
1. Controlling Unit: millimeter
2. Tolerance on the position of the leads is + 0.04 mm maximum.
3. Package body dimensions D1 and E1 do not include the mold protrusion.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
23.70
11.85
19.90
17.70
13.90
0.05
2.55
8.85
0.73
0.10
0.13
0.13
MIN
0
~
~
~
~
~
Maximum mold protrusion is 0.25 mm.
o
Figure 3 128 Pin QFP Package Outline, 3.9 MM Footprint
NOMINAL
0.5 Basic
23.90
17.90
14.00
11.95
20.0
8.95
0.88
1.95
~
~
~
~
~
~
~
~
~
~
Table 2 128 Pin QFP Package Parameters
PRODUCT PREVIEW
0.0762
24.10
12.05
20.10
18.10
14.10
MAX
3.05
9.05
1.03
0.30
0.30
0.08
3.4
0.5
7
~
~
~
o
6
1
1
/
/
2
2
10/100 Non-PCI Ethernet Single Chip MAC + PHY
X Span Measured from Centerline
Y Span Measured from Centerline
Coplanarity (Assemblers)
Coplanarity (Test House)
Overall Package Height
Lead Frame Thickness
Lead Shoulder Radius
Lead Foot Length
Lead Foot Radius
Lead Foot Angle
Body Thickness
Lead Length
X body Size
Y body Size
REMARKS
Lead Width
Lead Pitch
Standoff
X Span
Y Span
SMSC LAN91C111 REV C