TJA1054AT/S900 NXP Semiconductors, TJA1054AT/S900 Datasheet - Page 22
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TJA1054AT/S900
Manufacturer Part Number
TJA1054AT/S900
Description
Network Controller & Processor ICs FTCAN TRANSCEIVER
Manufacturer
NXP Semiconductors
Datasheet
1.TJA1054ATS900.pdf
(27 pages)
Specifications of TJA1054AT/S900
Number Of Transceivers
1
Power Down Mode
Sleep/Standby
Operating Supply Voltage (max)
5.25V
Operating Supply Voltage (typ)
5V
Operating Supply Voltage (min)
4.75V
Package Type
SO
Supply Current
0.125/27mA
Operating Temperature (max)
150C
Operating Temperature (min)
-40C
Operating Temperature Classification
Automotive
Mounting
Surface Mount
Pin Count
14
Product
Controller Area Network (CAN)
Data Rate
125 KBd
Supply Voltage (max)
5.25 V
Supply Voltage (min)
4.75 V
Supply Current (max)
27 mA
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Package / Case
SO
Lead Free Status / RoHS Status
Compliant
Other names
TJA1054AT/S900,512
NXP Semiconductors
TJA1054A
Product data sheet
15.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 11.
Table 12.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
≥ 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 11
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
All information provided in this document is subject to legal disclaimers.
12
10.
Rev. 5 — 3 August 2010
Package reflow temperature (°C)
Volume (mm
< 350
235
220
Package reflow temperature (°C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
10) than a SnPb process, thus
Fault-tolerant CAN transceiver
≥ 350
220
220
TJA1054A
245
> 2000
260
245
© NXP B.V. 2010. All rights reserved.
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