LT1795ISW#TRM Linear Technology, LT1795ISW#TRM Datasheet - Page 11

• Manufacturer Part Number: LT1795ISW#TRM
• Manufacturer: Linear Technology

Specifications of LT1795ISW#TRM

• Power Supply Requirement: Dual
• Package Type: SOIC W
• Slew Rate: 900V/us
• Pin Count: 20
• Lead Free Status / RoHS Status: Not Compliant

PACKAGE DESCRIPTIO
6.60 0.10
(.0036 – .0079)
0.09 – 0.20
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
4.50 0.10
RECOMMENDED SOLDER PAD LAYOUT
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
(.169 – .177)
4.30 – 4.50*
(.018 – .030)
0.45 – 0.75
SEE NOTE 4
(.195)
MILLIMETERS
4.95
U
(INCHES)
0.65 BSC
20-Lead Plastic TSSOP (4.4mm)
0.45 0.05
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation CA
(.108)
2.74
1.05 0.10
0 – 8
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
4. RECOMMENDED MINIMUM PCB METAL SIZE
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
FOR EXPOSED PAD ATTACHMENT
FE Package
(.0256)
0.65
BSC
20 1918 17 16 15
1
(.0077 – .0118)
0.195 – 0.30
2
3 4 5 6 7 8 9 10
(.252 – .260)
6.40 – 6.60*
(.195)
4.95
14 13
12
11
FE20 (CA) TSSOP 0203
(.002 – .006)
0.05 – 0.15
(.108)
(.047)
2.74
1.20
MAX
6.40
BSC
LT1795
11
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