GP1500-0.060-02-0404 Bergquist, GP1500-0.060-02-0404 Datasheet - Page 22

• Manufacturer Part Number: GP1500-0.060-02-0404
• Description: THERMAL PAD .060" 4X4" GAPPAD
• Manufacturer: Bergquist
• Series: Gap Pad® 1500r

Specifications of GP1500-0.060-02-0404

• Usage: Sheet
• Shape: Square
• Outline: 101.60mm x 101.60mm
• Thickness: 0.060" (1.52mm)
• Adhesive: Tacky - Both Sides
• Color: Black
• Thermal Conductivity: 1.5 W/m-K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Backing, Carrier: -
• Thermal Resistivity: -
• Other names: .060 GP 1500 4"X4"; BER163; GAPPAD1500-60MIL4X4

20
Solutions For Surface-Mount Applications
Thermal Clad
Intel Core
Phenom
Hi-Flow
The Hi-Flow family of phase change materials offers an easy-to-apply thermal interface
for many surface mount packages. At the phase change temperature, Hi-Flow materials
change from a solid and flow with minimal applied pressure.This characteristic optimizes
heat transfer by maximizing wet-out of the interface. Hi-Flow is commonly used to
replace messy thermal grease.
Bergquist phase change materials are specially compounded to prevent pump-out of
the interface area, which is often associated with thermal grease.Typical applications for
Hi-Flow materials include:
• Intel Core
• DC/DC converters
• Power modules
Hi-Flow materials are manufactured with or without film or foil carriers.
Custom shapes and sizes for non-standard applications are also available.
Sil-Pad
Sil-Pad is the benchmark in thermal interface materials. The Sil-Pad family of materials
are thermally conductive and electrically insulating. Available in custom shapes, sheets,
and rolls, Sil-Pad materials come in a variety of thicknesses and are frequently used in
SMT applications such as:
• Interface between thermal vias in a PCB, and a heat sink or casting
• Heat sink interface to many surface mount packages
Sil-Pad or
Bond-Ply
Power Device
Power Device
Processor
TM
TM
and Athlon
and Pentium
®
Mid Power Application with Bond-Ply or Sil-Pad
TM
®
Series, Pentium
®
are registered trademarks of Advanced Micro Devices, Inc.
®
are registered trademarks of Intel Corporation.
Hi-Flow without Thermal Clad
Hi-Flow with Thermal Clad
High Power Application
High Power Application
®
, Phenom
TM
, Athlon
®
, and other high performance CPUs
Hi-Flow
FR-4
Hi-Flow
Heat
Spreader
Heat
Spreader
FR-4 Board
Heat
Spreader