951 Bergquist, 951 Datasheet - Page 20

• Manufacturer Part Number: 951
• Description: THERMAL PAD TO-220 .009" SP1000
• Manufacturer: Bergquist
• Series: Sil-Pad® 1000r

Specifications of 951

• Usage: TO-220
• Shape: Rectangular
• Outline: 19.05mm x 12.70mm
• Thickness: 0.009" (0.229mm)
• Backing, Carrier: Fiberglass
• Color: Pink
• Thermal Resistivity: 0.35°C/W
• Thermal Conductivity: 1.2 W/m-K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Adhesive: -
• Other names: 951; BER199

18
Assembly Recommendations
Wire soldering on Thermal Clad.
Standard stars and squares in the most popular LED footprints
available through distribution. Contact Bergquist Sales for more
information.
Solder Assembly
Solder joints deserve additional consideration in the design of Thermal
Clad assemblies.This section covers solder surface finishes, application
and thickness, alloy and flux.
Surface Finishes
Standard circuit board finishes are available for Thermal Clad
circuit boards.
• ENIG (Electroless Nickel/Immersion Gold)
• OSP (Organic Solderability Protectant)
• Immersion silver or tin and lead-free HASL
• Standard tin/lead HASL
• ENEPIG (Electroless Nickel/Electroless Palladium/Immersion Gold)
• Electroless gold
Application and Thickness - Solder Paste
The typical application technique is metal stencil. Dispensing of solder to
specific locations is used for secondary operations or special attachment
requirements. No other decision will effect the reliability of the solder
joint as much as the thickness of the solder to be used. A minimum of
0.004" (102µm) is recommended (after reflow).This thickness dissipates
stress buildup in the joint. Additional information regarding solder joint
reliability is offered in the appendix.
Note: Additional thickness and/or larger stencil opening may need to be
utilized for RoHS compliance applications. Use profile recommended by the
component manufacturer.
Now Available
T-Clad Bond-Ply 450 PA
Thermal Clad with Bond-Ply 450 PA is a
thermally conductive adhesive tape that is the
first of many pre-applied offerings to come.
This material features a release liner on the
back side for easy removal and application
to a heat sink. T-Clad PA substrate release liners
can withstand high temperatures and will maintain
adhesion and release characteristics even after exposure to the
extreme heat of solder reflow. For a complete data sheet, contact
Bergquist Sales.
5
Ramp-up
3°C/s
max
Stabilization/soak
(90-120 s)
3
Ramp-down
6°C/s
max