173-7-220P Wakefield Thermal Solutions, 173-7-220P Datasheet

173-7-220P

Manufacturer Part Number

173-7-220P

Description

THERMAL PAD TO-220 .007" GRAY

Manufacturer

Wakefield Thermal Solutions

Series

DeltaPad™r

Datasheet

1.173-7-240P.pdf (5 pages)

Specifications of 173-7-220P

Length

0.71 in

Usage

TO-220

Shape

Rectangular

Outline

18.00mm x 12.70mm

Thickness

0.007" (0.178mm)

Backing, Carrier

Kapton®

Color

Gray

Thermal Resistivity

0.33°C/W

Thermal Conductivity

12.6 W/m-K

Width

0.5 in

Mounting Hole Dia

4.1mm

Overall Width

12.7mm

Thermal Resistance

0.33Â°C/W

Package / Case

TO-220

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Adhesive

Lead Free Status / Rohs Status

Lead free / RoHS Compliant

Other names

345-1000

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

173-7-220P

Manufacturer:

WAK

Quantity:

16 904

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THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS

120 SERIES

126 SERIES

Normally stocked

The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces

with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal

resistance of only 0.05°C/W for a 0.001 in. film with an area of one square inch. There is no measurable

increase in case temperature of a mounted semiconductor on a heat sink after the 6-month stabilization period

(Time versus Thermal Resistivity graph below).

Case Style Characteristics

T0-3

TO-66

0.19 (4.8) stud x 0.44 (11.2) hex

0.38 (9.7) stud x 1.06 (26.9) hex

0.50 (12.7) stud x 1.06 (26.9) hex

TO-220

0.25 (6.4) stud x 0.69 (17.5) hex

0.75 (19.1) stud x 1.25 (31.8) hex

The 126 Series is a nontoxic, synthetic, ester-based (nonsilicone) Thermal Joint Compound with metal oxide

fillers designed to enhance thermal performance characteristics of plastic and metal package devices exceeding

that of silicone-based compounds. Solved are problems associated with contamination of wave solder baths and

migration of silicone-based products.

Shelf life: 5 years.

Appearance

Solids Content, wt %

Thermal Conductivity at 36°C = 4.8 (Btu)(in.)/(hr) (ft

Interface Thermal Resistance

Bleed, 24 hrs at 200°C, wt%

Evaporation, 24 hrs at 200°C, wt%

Volume Resistivity

Dielectric Strength

Specific Gravity @ 60°F

Penetration

Operating Range

TYPICAL VALUES FOR THERMAL RESISTANCE,

CASE TO SINK (Ø cs ) WHEN THERMAL JOINT

COMPOUNDS ARE USED

Characteristics

126 SERIES THERMAL JOINT COMPOUND

125 (14.12)

600 (67.79)

Mounting Torque

in inch • pounds Resistance

30 (3.39)

75 (8.47)

15 (1.7)

9 (0.9)

8 (0.9)

(N•M)

) (°F)

Thermal

Typical

(°C/W)

0.09

0.14

0.50

0.16

0.10

0.07

0.052

Smooth, white homogeneous paste

65% min

19.0 X 10e 4 cal/sec cm °C, min

0.043°C/W TO-3 at 0.0008 thick film

0.09% max

0.6 max

2.3 x 10e 12 ohms/cm

200 volts/mil

2.93 (gm/cc)

280 to 320

-40°C to 200°C

All other products, please contact factory for price, delivery, and minimums.

Volume Resistivity

Dielectric Strength

Specific Gravity

Thermal Conductivity @ WC

Thermal Resistivity (P)

Bleed, % after 24 hrs @ 200°C

Evaporation, % after 24 hrs @ 200°C

Color

Shelf life

Operating Temperature Range (°C)

Description

120 SERIES - THERMAL JOINT COMPOUND

Characteristic

120-5

120-8

120-80

120-320

120-SA

120-2

Series -

120 SERIES - ORDER GUIDE

P/N

126-2

126-4

126-4S

126-5LB

Series -

5 oz (0.14 kg) tube

20 lb (9.08 kg) can

4 gram plastic pak

5 lb (2.27 kg) can

2 oz (0.06 kg) jar

8 oz (0.23 kg) jar

P/N

Container Size

126 SERIES - ORDER GUIDE

5 X 10e 14 ohm/cm

225 volts/mil

2.1 min.

0.735 W/(m)(K)

56 (°C)(in.)/watt

0.5

opaque white

5 years

-40/+200

5.1(Btu) (in.)/(hr)(ft

Description

4 oz (0.11 kg) syringe

4 oz (0.11 kg) tube

5 lb (2.27 kg) can

2 oz (0.6 kg) jar

Container Size

Accessory

Products

)(°F)

Related parts for 173-7-220P

173-7-220P Summary of contents

Page 1

THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent ...

Page 2

Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS DeltaBond™ 152 adhesive is ideal for general cementing; thermally bonding semiconductors and components to DeltaBond™ 152 chassis or heat sinks, while electrically isolating one from the other; fabricating heat sinks or thermal ...

Page 3

THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS DeltaCast™ 153 is a pourable casting resin having thermal expansion characteristics similar to aluminum and DeltaCast™ 153 copper allowing assemblies to operate over a very wide temperature range. Ideal for encapsulating components and assemblies, ...

Page 4

Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS DeltaBond™ 155 DeItaBond™ 155 is an epoxy adhesive formulated for use within the semiconductor industry. An easy to mix spread thixotropic paste, it offers high heat transfer, low shrinkage, and a coefficient ...

Page 5

... Recommended Mounting Pressure, lb/in. ciated with thermal greases. 173-7 173-9 Series Series No Adhesive No Adhesive Backing Adhesive 173-7-210P – 173-9-210P 173-7-220P – 173-9-220P 173-7-230P – 173-9-230P 173-7-240P 173-7-240A 173-9-240P 173-7-250P – 173-9-250P – – – – – 173-9-280P 173-7-290P – ...

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