658-45ABT2 Wakefield Thermal Solutions, 658-45ABT2 Datasheet - Page 3

• Manufacturer Part Number: 658-45ABT2
• Description: HEATSINK CPU 28MM SQ BLK W/TAPE
• Manufacturer: Wakefield Thermal Solutions
• Series: 658r

Specifications of 658-45ABT2

• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Thermal Tape, Adhesive (Included)
• Outline: 27.94mm x 27.94mm
• Height: 0.45" (11.43mm)
• Power Dissipation @ Temperature Rise: 3W @ 50°C
• Thermal Resistance @ Forced Air Flow: 6.0°C/W @ 200 LFM
• Product: Heatsinks
• Mounting Style: SMD/SMT
• Heatsink Material: Aluminum
• Fin Style: Omnidirectional Pin
• Dimensions: 27.9 mm L x 27.9 mm W x 11.43 mm H
• Designed For: BGA, Super BGA, PBGA, FPBGA, PowerPC
• Color: Black
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Thermal Resistance @ Natural: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 345-1070

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
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