624-45AB Wakefield Thermal Solutions, 624-45AB Datasheet - Page 7

• Manufacturer Part Number: 624-45AB
• Description: HEATSINK CPU 21MM SQ W/OUT ADH
• Manufacturer: Wakefield Thermal Solutions
• Series: 624r

Specifications of 624-45AB

• Height: 0.45" (11.43mm)
• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Thermal Tape, Adhesive (Not Included)
• Outline: 21.00mm x 21.00mm
• Packages Cooled: BGA / LED
• Width: 21mm
• Heat Sink Material: Aluminum
• Length: 21mm
• Mounting Type: Clip-On
• Package / Case: BGA
• Color: Black
• Product: Heatsinks
• Mounting Style: SMD/SMT
• Heatsink Material: Aluminum
• Fin Style: Omnidirectional Pin
• Dimensions: 21 mm L x 21 mm W x 11.4 mm H
• Designed For: BGA, Super BGA, PBGA, FPBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power Dissipation @ Temperature Rise: -
• Thermal Resistance @ Forced Air Flow: -
• Thermal Resistance @ Natural: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: Q1897442

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
2. Optional factory preapplied pressure-sensitive adhesive. See Page 3
PRODUCT FEATURES
919541 Series Heat Sink Thermal Performance
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Approach Air Velocity, LFM
Performance shown is with S5 interface material applied.