609-50ABS3 Wakefield Thermal Solutions, 609-50ABS3 Datasheet - Page 9

• Manufacturer Part Number: 609-50ABS3
• Description: HEATSINK FOR POWERPC CPU BLK
• Manufacturer: Wakefield Thermal Solutions
• Series: 609r

Specifications of 609-50ABS3

• Height: 0.500" (12.70mm)
• Color: Black
• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Clip
• Outline: 73.53mm x 50.80mm
• Thermal Resistance @ Forced Air Flow: 2°C/W @ 400 LFM
• Product: Heatsinks
• Mounting Style: Screw
• Heatsink Material: Aluminum
• Fin Style: Unidirectional Fin
• Dimensions: 73.5 mm L x 50.8 mm W x 12.7 mm H
• Designed For: BGA, Super BGA, PBGA, FPBGA, PowerPC
• Packages Cooled: BGA
• Width: 50.8mm
• Mounting Type: Clip-On
• Length: 73.5mm
• Package / Case: BGA
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power Dissipation @ Temperature Rise: -
• Thermal Resistance @ Natural: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 345-1058

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
Designed to fit a .063” thick PCB
electronic package thickness of .110”
See 609 Series for PCB hole layout for clip attachment
DIM.
“A”
619 95 AB 124 D1 S3
2.808
Thermal Interface Material Option
Blank
S5
S6
S3
S4
5
4
3
2
1
0
*Performance is for shrouded conditions. 609-100
will perform better than 609-50 in cases with bypass.
Bergquist Qpad 3
Bergquist Softface
Chomerics T710
Chomerics T443
*
609-100AB
100
None
609-50AB
AIR VELOCITY (LFM)
200
300
400
500