624-25ABT4 Wakefield Thermal Solutions, 624-25ABT4 Datasheet - Page 5
![HEATSINK CPU 21MM SQ W/DBL TAPE](/photos/5/89/58942/624-25abt4_sml.jpg)
624-25ABT4
Manufacturer Part Number
624-25ABT4
Description
HEATSINK CPU 21MM SQ W/DBL TAPE
Manufacturer
Wakefield Thermal Solutions
Series
624r
Datasheet
1.658-60ABT3.pdf
(19 pages)
Specifications of 624-25ABT4
Height
0.250" (6.35mm)
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Included)
Outline
21.00mm x 21.00mm
Thermal Resistance @ Forced Air Flow
25°C/W @ 200 LFM
Packages Cooled
BGA / LED
Width
21mm
Heat Sink Material
Aluminum
Length
21mm
Mounting Type
Adhesive
Package / Case
BGA
Color
Black
Product
Heatsinks
Mounting Style
Screw
Heatsink Material
Aluminum
Fin Style
Omnidirectional Pin
Dimensions
21 mm L x 21 mm W x 6.4 mm H
Designed For
BGA, Super BGA, PBGA, FPBGA
Lead Free Status / RoHS Status
Lead free / RoHS non-compliant
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Natural
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
345-1059
HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
Notes:
Notes:
L L
G
L
G G
I