658-25ABT4 Wakefield Thermal Solutions, 658-25ABT4 Datasheet - Page 18

• Manufacturer Part Number: 658-25ABT4
• Description: HEATSINK CPU 28MM SQ BLK W/TAPE
• Manufacturer: Wakefield Thermal Solutions
• Series: 658r

Specifications of 658-25ABT4

• Height: 0.250" (6.35mm)
• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Thermal Tape, Adhesive (Included)
• Outline: 27.94mm x 27.94mm
• Power Dissipation @ Temperature Rise: 4W @ 70°C
• Thermal Resistance @ Forced Air Flow: 5°C/W @ 500 LFM
• Packages Cooled: BGA / LED
• Width: 27.9mm
• Length: 27.9mm
• Mounting Type: Adhesive
• Package / Case: BGA
• Color: Black
• Product: Heatsinks
• Mounting Style: SMD/SMT
• Heatsink Material: Aluminum
• Fin Style: Omnidirectional Pin
• Dimensions: 27.9 mm L x 27.9 mm W x 6.35 mm H
• Designed For: BGA, Super BGA, PBGA, FPBGA, PowerPC
• Peak Reflow Compatible (260 C): No
• Leaded Process Compatible: No
• Rohs Compliant: No
• Lead Free Status / RoHS Status: Lead free / RoHS non-compliant
• Thermal Resistance @ Natural: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 345-1065

ROCKER CLIP OPTION
(SEE PRODUCT DES.)
SPRING CLIP OPTION
(SEE PRODUCT DES.)
2.34
OPTIONAL THERMAL INTERFACE
PAD (SEE PRODUCT DES.)
1.00
2.68
.23
1.50
.42
1.50
100 = 1.00"
MODEL NUMBER
HEIGHT
569 - 100 XX - XX
THERMAL INTERFACE
S4 = DELTALINK IV
BLANK = NO THERMAL PAD
CLIP
AK = SPRING CLIP
14-16 Pin DIPs