658-60AB Wakefield Thermal Solutions, 658-60AB Datasheet - Page 2
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658-60AB
Manufacturer Part Number
658-60AB
Description
HEATSINK CPU 28MM SQ BLK W/OTAPE
Manufacturer
Wakefield Thermal Solutions
Series
658r
Datasheet
1.658-60ABT3.pdf
(19 pages)
Specifications of 658-60AB
Height
0.600" (15.20mm)
Color
Black
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Not Included)
Outline
27.94mm x 27.94mm
Power Dissipation @ Temperature Rise
2.5W @ 30°C
Thermal Resistance @ Forced Air Flow
3°C/W @ 300 LFM
Product
Heatsinks
Mounting Style
SMD/SMT
Heatsink Material
Aluminum
Fin Style
Omnidirectional Pin
Dimensions
27.9 mm L x 27.9 mm W x 15.24 mm H
Designed For
BGA, Super BGA, PBGA, FPBGA, PowerPC
Packages Cooled
BGA / LED
Width
27.9mm
Heat Sink Material
Aluminum
Length
27.9mm
Mounting Type
Adhesive
Size
0.600H X 1.100W X 1.100L"
Package / Case
BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Thermal Resistance @ Natural
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
345-1072
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
658-60AB
Manufacturer:
WAK
Quantity:
7 840
Company:
Part Number:
658-60ABT2 REV P
Manufacturer:
WAK
Quantity:
49
HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
30
25
20
15
10
5
0
20
18
16
14
12
10
8
6
4
2
0
200
200
300
Approach Velocity, LFM
300
Approach Velocity, LFM
PRODUCT FEATURES
PRODUCT FEATURES
400
400
624-25-T4
624-35-T4
624-45-T4
624-60-T4
625-25-T4
625-25-T4
625-45-T4
625-60-T4
500
500
600
600