APF30-30-10CB CTS Thermal Management Products, APF30-30-10CB Datasheet - Page 2

• Manufacturer Part Number: APF30-30-10CB
• Description: HEATSINK LOW-PROFILE FORGED
• Manufacturer: CTS Thermal Management Products
• Series: APFr

Specifications of APF30-30-10CB

• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Thermal Tape, Adhesive (Not Included)
• Outline: 30.00mm x 30.00mm
• Height: 0.37" (9.40mm)
• Thermal Resistance @ Forced Air Flow: 3.3°C/W @ 200 LFM
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power Dissipation @ Temperature Rise: -
• Thermal Resistance @ Natural: -
• Other names: 294-1153

IERC a CTS Company
Page 2 of 2
Part Number Series
Dimensions in mm (L x W x H)
Commercial Black Anodize
Mounting Options
Adhesive
Double-sided Kapton®
Chomerics Thermattach®
Example:
APF19-19-10CB/A01
413 North Moss Street
APF 19-19-10 CB /A01
“/A01”
“T410, T411, or T412”
HOW TO ORDER?
Burbank, CA 91502
818-842-7277
www.ctscorp.com
October 2006