HP1-TO3-CB CTS Thermal Management Products, HP1-TO3-CB Datasheet - Page 3

• Manufacturer Part Number: HP1-TO3-CB
• Description: HEATSINK PWR .90"H BLACK TO-3
• Manufacturer: CTS Thermal Management Products
• Series: HP1r

Specifications of HP1-TO3-CB

• Package Cooled: TO-3
• Attachment Method: Bolt On
• Outline: 63.50mm x 63.50mm
• Height: 0.9" (22.86mm)
• Thermal Resistance @ Natural: 5.4°C/W
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power Dissipation @ Temperature Rise: -
• Thermal Resistance @ Forced Air Flow: -
• Other names: 294-1088

HP1 Series for Dual TO-66 Outline
Ordering Information
HP1-TO66-4U
HP1-TO66-36U
Unplated
•
•
•
Thermal Resistance Case to Sink is 0.5-0.7 °C/W w/Joint Compound.
Derate 2.0 °C/watt per device for unplated part in natural convection only.
Case Temperatures Match Within 2°C at equivalent power levels.
HP1-TO66-4CB
HP1-TO66-36CB
IERC PART NO.
Comm’l. Black
Anodize
HP1-TO66-4B
HP1-TO66-36B
Mil. Black
Anodize
Two TO-66s
Two TO-66 Ics
Accommodated
Semiconductor
DESCRIPTION OF CURVES
C.
G.
H.
I.
E.
N.C. Horiz. Device
Only Mounted to G-10.
N.C. Horiz. & Vert.
With Dissipator.
200 RPM w/Diss.
500 RPM w/Diss.
1000 RPM w/Diss.
32
34
Hole patt.
Ref. No.
(see pg.
1-30)
35.0
35.0
Max. Weight
(Grams)