9882 1 IN X 36 YD 3M, 9882 1 IN X 36 YD Datasheet - Page 2

• Manufacturer Part Number: 9882 1 IN X 36 YD
• Description: THERM COND ADH 2.0MIL 1"X36YD
• Manufacturer: 3M
• Type: Acrylic Adhesiver

Specifications of 9882 1 IN X 36 YD

• Size / Dimension: 1.00" W x 36 yd Roll
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 3M9590; 70006178910

I. Thermal/Mechanical
Technical Bulletin
System Design and Performance for 3M
Performance
Optimization
In this case, thermal impedance of the bond area, R
adhesive thermal resistance (¡C/in
resistance values typical of the 3Mª Thermally Conductive Tapes can be found in
the Data Page.) To optimize thermal performance one would simply use the thinnest
adhesive available.
Substrates often will have several thousands of an inch (mils) runout of flatness of
their surfaces and using the thinnest adhesive may lead to air gaps in the bond line of
the assembly as represented in the edge-on view below. When both substrates are
rigid materials this effect is especially likely to occur.
Now the adhesive no longer covers the entire area, A
smaller than A
impedance R
more complicated, but suffice to say the thermal impedance of the assembly is higher
because of air pockets. (Please see the 3M Technical Bulletin ÒHeat Flow Calculation
for 3M Thermally Conductive Tapes [9882, 9885, 9890]Ó for a method to determine
the total thermal impedance.) Choice of an adhesive layer much thicker than the
flatness runout can help reduce the air, as portrayed the bond area cross-sections
Optimized thermal and mechanical performance of systems assembled with 3Mª
Thermally Conductive Adhesive Transfer Tapes 9882, 9885 and 9890 depends,
among other things, on an balance of the material properties of the adhesive and the
substrates and the use of assembly conditions appropriate to the parts.
Thermal Impedance of the Assembly
In an ideal case, substrates are perfectly flat and the bond is made without air
entrapment:
(30% Contact, 70% Entrapped Air)
Bond Area Using 2 mil Adhesive
Ideal, Flat Substrates
Non-Flat Substrates
tot
tot
in the case of parallel adhesive and air thermal impedances is much
and air fills the rest of the area. Calculation of total thermal
TM
Thermally Conductive Tapes 9882, 9885, 9890
- 2 -
2
/W) divided by the bond area, A
Adhesive
Adhesive
tot
(85% Contact, 15% Entrapped Air)
Bond Area Using 10 mil Adhesive
tot
(¡C/W), would be equal to the
, rather it covers a contact area
tot
(in
2
). (Thermal