125700D00000G Aavid Thermalloy, 125700D00000G Datasheet - Page 9

• Manufacturer Part Number: 125700D00000G
• Description: SOLDER ANCHOR FOR BGA HEATSINKS
• Manufacturer: Aavid Thermalloy
• Type: Passiver

Specifications of 125700D00000G

• Accessory Type: Solder Anchor (2 required)
• Device Cooled: BGA
• Attachment Method: Clip
• Product Depth: 2.49 mm
• Product Height: 7.19 mm
• Product Length: 7.62 mm
• Product: Hardware & Accessories
• Mounting Style: SMD/SMT
• Dimensions: 7.62 mm L x 2.49 mm W x 7.19 mm H
• For Use With/related Products: BGA Heat Sinks
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: HS400

The basic equation for heat transfer or power dissipation may be stated as follows:
Where:
P D = the power dissipated by the semiconductor device in watts.
ΔT = the temperature difference of driving potential which causes the flow of heat.
ΣR θ = the sum of the thermal resistances of the heat flow path across which ΔT exists.
The above relationship may be stated in the following forms:
The above equations are generally used to determine the required thermal resistance of the heat sink (R θSA ),
since the heat dissipation, maximum junction and/or case temperature, and ambient temperature are known or set.
Figure 1 indicates the location of the various heat
flow paths, temperatures and thermal resistances.
FIGURE 1
Where:
T J = the junction temperature in °C (maximum is usually stated by the manufacturer of the semiconductor device).
T C = case temperature of the semiconductor device in °C.
T S = temperature of the heat sink mounting surface in thermal contact with the semiconductor device in °C.
T A = ambient air temperature in °C.
How to select a heat sink
P D =
R θJC = thermal resistance from junction to case of the semiconductor device in °C per watt
R θCS = thermal resistance through the interface between the semiconductor device
R θSA = thermal resistance from mounting surface to ambient or thermal resistance of heat sink in °C per watt.
P D =
Semiconductor case
www.aavidthermalloy.com
R θJC + R θCS + R θSA
(cooler/dissipator)
Mounting surface
(usually stated by manufacturer of semiconductor device).
(heat source)
and the surface on which it is mounted in °C per watt.
Δ T
ΣR θ
Junction
Interface
T J –T A
P
R
D
θJC
R
θCS
T
J
T
C
T
S
surface to ambient, equation (3)
AMERICA
to ambient, equation (1)
Heat flow path junction
to ambient equation (2)
EUROPE
Heat flow path mounting
Heat flow path case
R
θSA
Italy Tel: [phone] email: [e-mail]
United Kingdom Tel: [phone] email: [e-mail]
USA Tel: [phone] email: [e-mail]
P D =
P
D
Atmosphere
R θCS + R θSA
or ambient
T
T
T C –T A
A
A
The common practice is to represent the system with
a network of resistances in series as shown in Figure 2.
FIGURE 2
T J
R θJC
ASIA
P D =
How To Select a Heat Sink
Singapore Tel: [phone] email: [e-mail]
Taiwan Tel: [phone] email: [e-mail]
T S –T A
T C
R θSA
R θCS
T S
R θSA
T A
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