HCP0805-2R2-R Cooper/Bussmann, HCP0805-2R2-R Datasheet
HCP0805-2R2-R
Specifications of HCP0805-2R2-R
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HCP0805-2R2-R Summary of contents
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... HCP0805-1R0-R 1.00 HCP0805-1R5-R 1.50 HCP0805-2R2-R 2.20 1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10V rms , 0.0Adc 2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1V rms , I sat rms : DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise recommended the part temperature not exceed 125° ...
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... R 2 The nominal DCR is measured from point “a” to point”b.” xxx = Inductance value in μ Decimal point “R” is present, then last character zeros Part Marking: HCP0805 Packaging Information - mm 1.5 Dia Section A-A 5.2 Supplied in tape-and-reel packaging, 700 parts per reel, 13” diameter reel. ...
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Core Loss 100 10 1 0.1 0.01 0.001 100 Inductance Characteristics 110% 100% 90% 80% 70% 60% 50% 40% 30% 20% 10 20% 40% 1108 BU-SB08798 vs 1000 B ...
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Solder Reflow Profile T P Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C Preheat A T smax T smin t s 25°C Time 25°C to Peak Reference JDEC J-STD-020D Profile Feature Preheat and Soak ...