5-104693-3 TE Connectivity, 5-104693-3 Datasheet - Page 14

• Manufacturer Part Number: 5-104693-3
• Description: Conn Shrouded Header HDR 30 POS 1.27mm Solder ST SMD Tube
• Manufacturer: TE Connectivity
• Type: Shrouded Headerr
• Series: AMPMODU 50/50 Gridr

Specifications of 5-104693-3

• Pitch: 1.27 mm
• Number Of Rows: 2
• Number Of Contacts: 30
• Gender: HDR
• Contact Plating: Gold Over Nickel
• Termination Method: Solder
• Pitch Spacing: 1.27mm
• No. Of Contacts: 30
• No. Of Rows: 2
• Contact Termination: Surface Mount Vertical
• Contact Material: Phosphor Bronze
• Rohs Compliant: Yes
• Product Type: Headers
• Stack Height: 9.91 mm
• Mounting Style: SMD/SMT
• Mounting Angle: Vertical
• Number Of Positions / Contacts: 30
• Housing Material: Liquid Crystal Polymer (LCP)
• Voltage Rating: 30 VAC
• Current Rating: 1 A to 4 A
• Connector Type: Header
• Mount Angle: Vertical
• Pcb Mount Retention: With
• Mating Connector Lock: Without
• Hold-down Post Material: Copper Alloy
• Hold-down Post Plating: Tin (150) over Nickel (50)
• Insulation Resistance (m?): 5,000
• Voltage (vac): 30
• Dielectric Withstanding Voltage (v): 300
• Contact - Rated Current (a): 1 – 4
• Solder Tail Contact Plating: Tin
• Mated Stack Height (vertical) (mm [in]): 9.91 [0.390]
• Number Of Positions: 30
• Pcb Mount Retention Type: Hold Down Post(s)
• Contact Base Material: Phosphor Bronze
• Contact Plating, Mating Area, Material: Gold (30)
• Underplate Material: Nickel
• Connector Style: Plug
• Mating Alignment: With
• Mating Alignment Type: Keyed
• Ul Flammability Rating: UL 94V-0
• Housing Color: Black
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C, Reflow solder capable to 260°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Approved Standards: UL E28476, CSA LR7189
• Temperature Range (°c): -65 – +105
• Packaging Method: Tube
• Lead Free Status / Rohs Status: Details

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14
Product Facts
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Catalog 1307819
Revised 8-08
www.tycoelectronics.com
Surface-mount products for
parallel board-to-board
applications, as well as
right-angle board-to-board
and cable-to-board
applications
High density .050 x .050
[1.27x1.27] centerline grid
Three board-to-board stack
heights: .250 [6.35], .320
[8.13] and .390 [9.91]
Non-protrusive metallic
holddowns
Reliable dual beam
receptacle contacts for
redundant contact
Duplex plated receptacle
and post contacts; gold
plated on mating areas,
tin plated on tails
Compatible with standard
surface-mount processing
(VPR and IR)
Receptacle and header allow
for drainage of processing
fluids
Tape and reel packaging
available. Contact
Tyco Electronics for details
Polarized header and recep-
tacle assemblies
Sizes of 10, 20, 30, 40, 50,
60, 70, 80 and 100 positions
Recognized under the
Component Program of
Underwriters
Laboratories Inc.,
File No. E28476
Certified by
Canadian Standards
Association
File No. LR7189
R
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
R
AMPMODU Interconnection System
Board-to-Board Vertical Receptacles and Headers
AMPMODU 50/50 Grid
Vertical Headers and
Receptacles are designed
for parallel board-to-board
stacking in high density
applications.
Right-angle board-to-board
and cable-to-board
applications are also
possible, since the vertical
receptacles also mate with
non-latching right-angle
headers (page 19) and the
vertical headers also mate
with non-latching cable
connectors.
Available are double row,
vertical shrouded headers
and receptacles in sizes
ranging from 10 through
100 positions (in 10 position
increments).
Parallel board-to-board
stack heights of .250 [6.35],
.320 [8.13] and .390 [9.91]
are achievable by selection
of the appropriate header.
The receptacle is the same
for all three stack height
headers.
Non-protrusive metallic
holddowns are designed for
use in .062 [1.57] or thicker
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
PC boards and allow
surface mounting to both
sides of the board. In
addition to providing
retention during processing,
the holddowns are soldered
during reflow and therefore
provide long-term strain relief
for the solder joints.
AMPMODU 50/50 Grid
Vertical Headers and
Receptacles are designed
to be compatible with
standard surface-mount
processes; IR (infrared) and
VPR (vapor phase reflow).
The surface-mount
connectors have been
designed so that
dimensioning, tolerances,
referenced datums,
holddown characteristics
Non-Protrusive
Metallic Holddowns
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
and packaging methods
result in a system that is
compatible with robotic
assembly.
The headers and
receptacles feature
polarization to prevent
misalignment.
Three Board Stack Heights
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
[9.91±0.15]
[6.35±0.15 ]
[8.13±0.15]
.390±.006
.250±.006
.320±.006