535512-7 TE Connectivity, 535512-7 Datasheet - Page 14
![Conn Socket Strip RCP 50 POS 2.54mm Solder RA Thru-Hole Gang of Tubes](/photos/41/36/413617/pr1055030a_sml.jpg)
535512-7
Manufacturer Part Number
535512-7
Description
Conn Socket Strip RCP 50 POS 2.54mm Solder RA Thru-Hole Gang of Tubes
Manufacturer
TE Connectivity
Type
Socket Stripr
Series
Mod II Seriesr
Datasheet
1.1-102618-8.pdf
(320 pages)
Specifications of 535512-7
Pitch
2.54 mm
Number Of Rows
2
Number Of Contacts
50
Gender
RCP
Contact Plating
Gold Over Nickel
Termination Method
Solder
Rohs Compliant
NO
Product Type
Receptacles / Sockets - PCB
Number Of Positions / Contacts
50
Mounting Style
Through Hole - Solder
Mounting Angle
Right
Termination Style
Solder Pin
Housing Material
Polyester Polycyclohexylenedimethylene Terephthalate (PCT)
Contact Material
Phosphor Bronze
Current Rating
2 A
Operating Temperature Range
- 55 C to + 125 C
Connector Series
Mod II
Profile
Standard
Mounting Pattern (mm [in])
2.54 x 7.87 [.100 x .310]
Sealed
No
Holddown Feature
Without
Pcb Mounting Orientation
Right Angle
Pcb Mount Retention
Without
Termination Method To Pc Board
Through Hole - Solder
Closed Entry
With
Board Standoff
With
Stackable
Yes
Contact - Rated Current (a)
2
Contact Resistance (m?)
12
Insulation Resistance (m?)
5,000
Dielectric Withstanding Voltage (v)
750
Termination Post Length (mm [in])
2.92 [0.115]
Solder Tail Contact Plating
Tin-Lead over Nickel
Connector Height (mm [in])
6.05 [0.238]
Number Of Positions
50
Centerline, Matrix (mm [in])
2.54 x 2.54 [.100 x .100]
Contact Plating, Mating Area, Material
Gold (30)
Contact Base Material
Phosphor Bronze
Contact Configuration
Short Point
Housing Entry Style
Side
Ul Flammability Rating
UL 94V-0
Housing Color
Black
Government/industry Qualification
No
Rohs/elv Compliance
Not ELV/RoHS compliant
Lead Free Solder Processes
Reflow solder capable to 245°C, Reflow solder capable to 260°C
Approved Standards
UL E28476, CSA LR7189
Operating Temperature (°c)
-55 – +125
High Temperature Compatible
Yes
Packaging Quantity
40
Packaging Method
Gang of Tubes
Lead Free Status / Rohs Status
No
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
535512-7
Manufacturer:
TE Connectivity AMP Connectors
Quantity:
3 364
- Current page: 14 of 320
- Download datasheet (17Mb)
2
14
Product Facts
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Catalog 1307819
Revised 8-08
www.tycoelectronics.com
Surface-mount products for
parallel board-to-board
applications, as well as
right-angle board-to-board
and cable-to-board
applications
High density .050 x .050
[1.27x1.27] centerline grid
Three board-to-board stack
heights: .250 [6.35], .320
[8.13] and .390 [9.91]
Non-protrusive metallic
holddowns
Reliable dual beam
receptacle contacts for
redundant contact
Duplex plated receptacle
and post contacts; gold
plated on mating areas,
tin plated on tails
Compatible with standard
surface-mount processing
(VPR and IR)
Receptacle and header allow
for drainage of processing
fluids
Tape and reel packaging
available. Contact
Tyco Electronics for details
Polarized header and recep-
tacle assemblies
Sizes of 10, 20, 30, 40, 50,
60, 70, 80 and 100 positions
Recognized under the
Component Program of
Underwriters
Laboratories Inc.,
File No. E28476
Certified by
Canadian Standards
Association
File No. LR7189
R
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
R
AMPMODU Interconnection System
Board-to-Board Vertical Receptacles and Headers
AMPMODU 50/50 Grid
Vertical Headers and
Receptacles are designed
for parallel board-to-board
stacking in high density
applications.
Right-angle board-to-board
and cable-to-board
applications are also
possible, since the vertical
receptacles also mate with
non-latching right-angle
headers (page 19) and the
vertical headers also mate
with non-latching cable
connectors.
Available are double row,
vertical shrouded headers
and receptacles in sizes
ranging from 10 through
100 positions (in 10 position
increments).
Parallel board-to-board
stack heights of .250 [6.35],
.320 [8.13] and .390 [9.91]
are achievable by selection
of the appropriate header.
The receptacle is the same
for all three stack height
headers.
Non-protrusive metallic
holddowns are designed for
use in .062 [1.57] or thicker
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
PC boards and allow
surface mounting to both
sides of the board. In
addition to providing
retention during processing,
the holddowns are soldered
during reflow and therefore
provide long-term strain relief
for the solder joints.
AMPMODU 50/50 Grid
Vertical Headers and
Receptacles are designed
to be compatible with
standard surface-mount
processes; IR (infrared) and
VPR (vapor phase reflow).
The surface-mount
connectors have been
designed so that
dimensioning, tolerances,
referenced datums,
holddown characteristics
Non-Protrusive
Metallic Holddowns
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
and packaging methods
result in a system that is
compatible with robotic
assembly.
The headers and
receptacles feature
polarization to prevent
misalignment.
Three Board Stack Heights
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
[9.91±0.15]
[6.35±0.15 ]
[8.13±0.15]
.390±.006
.250±.006
.320±.006
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