2-111196-8 TE Connectivity, 2-111196-8 Datasheet - Page 19
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2-111196-8
Manufacturer Part Number
2-111196-8
Description
Conn IDC Connector RCP 24 POS 1.27mm IDT RA Cable Mount
Manufacturer
TE Connectivity
Type
IDC Connectorr
Series
AMPMODU System 50r
Datasheet
1.2-111196-8.pdf
(60 pages)
Specifications of 2-111196-8
Pitch
1.27 mm
Number Of Rows
2
Number Of Contacts
24
Gender
RCP
Contact Plating
Gold Over Nickel
Termination Method
IDT
Pitch (mm)
1.27mm
Number Of Contact Rows
2
Mounting Style
Cable
Body Orientation
Right Angle
Operating Temp Range
-65C to 105C
Current Rating (max)
0.5/ContactA
Voltage Rating Max
30VAC
Contact Material
Phosphor Bronze
Contact Resistance Max
30mOhm
Housing Material
Liquid Cryst Polymer
Housing Color
Black
Product Height (mm)
14.73mm
Product Length (mm)
21.84mm
Product Depth (mm)
6.45mm
Connector Type
Wire To Board
Contact Termination
IDC / IDT
No. Of Contacts
24
No. Of Rows
2
Pitch Spacing
1.27mm
Rohs Compliant
Yes
Product Type
Free Hanging Receptacles
Number Of Positions / Contacts
24
Voltage Rating
30 VAC
Current Rating
0.5 A
Wire Type
Ribbon Cable
Type Of Connector
Rectangular
Mating Connector Lock
With
Wire/cable Type
Ribbon Cable
Mating Connector Lock Type
Latch
Voltage (vac)
30
Insulation Resistance (m?)
5,000
Contact - Rated Current (a)
0.5
Solder Tail Contact Plating
Tin
Number Of Positions
24
Ribbon Cable Centerline Spacing (mm [in])
0.64 [0.025]
Latch Material
Stainless Steel
Contact Base Material
Phosphor Bronze
Contact Plating, Mating Area, Material
Gold
Connector Style
Receptacle
Ul Flammability Rating
UL 94V-0
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Not relevant for lead free process
Rohs/elv Compliance History
Always was RoHS compliant
Applies To
Cable
Temperature Range (°c)
-65 – +105
Lead Free Status / RoHS Status
Compliant
Lead Free Status / RoHS Status
Compliant
Catalog 1307819
Revised 8-08
www.tycoelectronics.com
Product Facts
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Surface-mount option for
parallel board-to-board
applications; completely
intermateable with
AMPMODU System 50
thru-hole board-to-board
and cable-to-board systems
Double row, vertical,
shrouded header and
receptacle assemblies
Available in select sizes
from 10 through 100
positions
High Density; contacts
spaced on .050 x .100 [1.27
x 2.54] centers; compact
footprint
Compatible with standard
surface-mount processes
Stand-offs for free drainage
of flux cleaning solutions;
visible solder joints for easy
inspection
Simple, low insertion-force
holddown for process
retention and long-term
strain relief for solder joints
Available in tape and reel
packaging (with vacuum
covers) for automatic
placement.
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
AMPMODU Interconnection System
Surface-Mount Connectors, .050 x .100 [1.27 x 2.54] Centerline,
Board-to-Board
The high-density surface-
mount connector is another
mounting option in the
AMPMODU System 50
connector family.
This surface-mount system
is fully intermateable with
the AMPMODU System 50
thru-hole and cable-to-
board connectors.
Additionally, the design of
the mating interface has not
been changed, maintaining
the same high reliability as
the thru-hole product.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
The surface-mount system
includes double row,
vertical, shrouded header
and receptacle assemblies
in select sizes from 10
through 100 positions. It
meets the tight dimensional
requirements of surface-
mount technology. The
simple, low insertion-force
holddown provides both
processing retention and
long-term strain relief for
the solder joints in the
headers and receptacles.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
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