1375795-2 TE Connectivity, 1375795-2 Datasheet - Page 14
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1375795-2
Manufacturer Part Number
1375795-2
Description
Conn PC/104 and PC/104 Plus Connector RCP 104 POS 2.54mm Press Fit ST Thru-Hole
Manufacturer
TE Connectivity
Type
PC/104 and PC/104 Plus Connectorr
Specifications of 1375795-2
Pitch
2.54 mm
Number Of Rows
4
Number Of Contacts
104
Gender
RCP
Contact Plating
Gold Over Nickel
Termination Method
Press Fit
Pitch Spacing
2.54mm
No. Of Rows
4
No. Of Contacts
104
Contact Termination
Press Fit
Contact Material
Phosphor Bronze
Pin Length
12.27mm
Rohs Compliant
Yes
Agency Approvals
cULus
Angle
Straight
Brand/series
AMPMODU
Centerline, Matrix
0.100 in.
Color
Black
Contact Type
Stackthrough
Current, Rating
3 A
Flammability Rating
UL94V-0
Length, Overall
81.6 mm
Length, Pin
0.483 "
Length, Terminal Post
0.483
Material, Contact
Phosphor Bronze
Material, Housing
Nylon
Mounting Hole Size
1.03/1.1-1.19 mm
Mounting Type
PCB
Number Of Positions
104
Pin Spacing
0.1 "
Plating, Contact Mating Area
Gold over Nickel
Primary Type
Interconnect System
Special Features
High Temperature
Standards
PC/104
Temperature, Operating
-55 to +105 °C
Termination
Press Fit
Product Type
Stackthrough
Termination Style
Screw
Housing Material
Nylon, Glass Filled
Pitch (mm)
2.54mm
Number Of Contact Rows
4
Mounting Style
Through Hole
Body Orientation
Straight
Operating Temp Range
-55C to 105C
Current Rating (max)
3/ContactA
Contact Resistance Max
10mOhm
Housing Color
Black
Product Height (mm)
11.05mm
Product Length (mm)
81.6mm
Product Depth (mm)
9.9mm
Keyed
No
Pcb Mount Style
Through Hole Press Fit
Board Standoff
Without
Signal Contact Current (a)
3
Insulation Resistance (m?)
1,000
Dielectric Withstanding Voltage (v)
500
Termination Post Length (mm [in])
12.27 [0.483]
Number Of Loaded Positions
104
Centerline (mm [in])
2.54 [0.100]
Pcb Mount Retention Type
Compliant Posts
Contact Configuration
Stackthrough
Contact Base Material
Phosphor Bronze
Contact Plating, Mating Area, Material
Gold
Ul Flammability Rating
UL 94V-0
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Not relevant for lead free process
Rohs/elv Compliance History
Always was RoHS compliant
Temperature Range (°c)
-55 – +105
Lead Free Status / Rohs Status
RoHS Compliant part
2
14
Product Facts
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Catalog 1307819
Revised 8-08
www.tycoelectronics.com
Surface-mount products for
parallel board-to-board
applications, as well as
right-angle board-to-board
and cable-to-board
applications
High density .050 x .050
[1.27x1.27] centerline grid
Three board-to-board stack
heights: .250 [6.35], .320
[8.13] and .390 [9.91]
Non-protrusive metallic
holddowns
Reliable dual beam
receptacle contacts for
redundant contact
Duplex plated receptacle
and post contacts; gold
plated on mating areas,
tin plated on tails
Compatible with standard
surface-mount processing
(VPR and IR)
Receptacle and header allow
for drainage of processing
fluids
Tape and reel packaging
available. Contact
Tyco Electronics for details
Polarized header and recep-
tacle assemblies
Sizes of 10, 20, 30, 40, 50,
60, 70, 80 and 100 positions
Recognized under the
Component Program of
Underwriters
Laboratories Inc.,
File No. E28476
Certified by
Canadian Standards
Association
File No. LR7189
R
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
R
AMPMODU Interconnection System
Board-to-Board Vertical Receptacles and Headers
AMPMODU 50/50 Grid
Vertical Headers and
Receptacles are designed
for parallel board-to-board
stacking in high density
applications.
Right-angle board-to-board
and cable-to-board
applications are also
possible, since the vertical
receptacles also mate with
non-latching right-angle
headers (page 19) and the
vertical headers also mate
with non-latching cable
connectors.
Available are double row,
vertical shrouded headers
and receptacles in sizes
ranging from 10 through
100 positions (in 10 position
increments).
Parallel board-to-board
stack heights of .250 [6.35],
.320 [8.13] and .390 [9.91]
are achievable by selection
of the appropriate header.
The receptacle is the same
for all three stack height
headers.
Non-protrusive metallic
holddowns are designed for
use in .062 [1.57] or thicker
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
PC boards and allow
surface mounting to both
sides of the board. In
addition to providing
retention during processing,
the holddowns are soldered
during reflow and therefore
provide long-term strain relief
for the solder joints.
AMPMODU 50/50 Grid
Vertical Headers and
Receptacles are designed
to be compatible with
standard surface-mount
processes; IR (infrared) and
VPR (vapor phase reflow).
The surface-mount
connectors have been
designed so that
dimensioning, tolerances,
referenced datums,
holddown characteristics
Non-Protrusive
Metallic Holddowns
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
and packaging methods
result in a system that is
compatible with robotic
assembly.
The headers and
receptacles feature
polarization to prevent
misalignment.
Three Board Stack Heights
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
[9.91±0.15]
[6.35±0.15 ]
[8.13±0.15]
.390±.006
.250±.006
.320±.006