104656-2 TE Connectivity, 104656-2 Datasheet - Page 2
![Conn Shrouded Header HDR 20 POS 1.27mm Solder ST SMD Tube](/photos/37/46/374661/pr4848007e_sml.jpg)
104656-2
Manufacturer Part Number
104656-2
Description
Conn Shrouded Header HDR 20 POS 1.27mm Solder ST SMD Tube
Manufacturer
TE Connectivity
Type
Shrouded Headerr
Series
AMPMODU 50/50 Grid Seriesr
Datasheet
1.104652-6.pdf
(13 pages)
Specifications of 104656-2
Pitch
1.27 mm
Number Of Rows
2
Number Of Contacts
20
Gender
HDR
Contact Plating
Gold Over Nickel
Termination Method
Solder
Product Type
Headers
Stack Height
8.13 mm
Mounting Style
Through Hole
Mounting Angle
Vertical
Number Of Positions / Contacts
20
Housing Material
Liquid Crystal Polymer (LCP)
Contact Material
Phosphor Bronze
Voltage Rating
30 VAC
Current Rating
1 A to 4 A
Connector Type
Header
Mount Angle
Vertical
Pcb Mount Retention
With
Mating Connector Lock
Without
Hold-down Post Material
Copper Alloy
Hold-down Post Plating
Tin-Lead (150) over Nickel (50)
Insulation Resistance (m?)
5,000
Voltage (vac)
30
Dielectric Withstanding Voltage (v)
300
Contact - Rated Current (a)
1 – 4
Solder Tail Contact Plating
Tin-Lead (150)
Mated Stack Height (vertical) (mm [in])
8.13 [0.320]
Number Of Positions
20
Pcb Mount Retention Type
Hold Down Post(s)
Contact Base Material
Phosphor Bronze
Contact Plating, Mating Area, Material
Gold (30)
Underplate Material
Nickel
Connector Style
Plug
Mating Alignment
With
Mating Alignment Type
Keyed
Ul Flammability Rating
UL 94V-0
Housing Color
Black
Rohs/elv Compliance
ELV compliant, 5 of 6 Compliant
Lead Free Solder Processes
Reflow solder capable to 245°C, Reflow solder capable to 260°C
Approved Standards
UL E28476, CSA LR7189
Temperature Range (°c)
-65 – +105
Packaging Method
Tube
Lead Free Status / Rohs Status
No
Product Facts
See Catalog 1307819 for
additional AMPMODU product
offerings.
Catalog 889092
Revised 9-06
www.tycoelectronics.com
Surface-mount products for
parallel board-to-board
applications, as well as
right angle board-to-board
and cable-to-board
applications
High density 1.27 x 1.27
[.050 x .050] centerline grid
Three board-to-board stack
heights: 6.35 [.250], 8.13
[.320] and 9.91 [.390]
Non-protrusive metallic
holddowns
Reliable dual beam
receptacle contacts for
redundant contact
Duplex plated receptacle
and post contacts; gold
plated on mating areas,
tin-lead plated on tails
Compatible with standard
surface-mount processing
(VPR and IR)
Receptacle and header
allow for drainage of
processing fluids
Tape and reel packaging
available, contact
Tyco Electronics for details
Polarized header and
receptacle assemblies
Sizes of 10, 20, 30, 40, 50,
60, 70, 80 and 100 positions
Recognized under the
Component Program of
Underwriters
Laboratories Inc.,
File No. E28476
Certified by Canadian
Standards
Association
File No. LR7189
R
Dimensions are in millimeters
and inches unless otherwise
specified. Values in brackets
are standard equivalents.
R
Fine Pitch SMT Stacking Connectors
(Parallel Board-to-Board)
Page_Head
AMPMODU 50/50 Grid Connectors
AMPMODU 50/50 Grid
Vertical Headers and
Receptacles are designed
for parallel board-to-board
stacking in high density
applications.
Right angle board-to-board
and cable-to-board applica-
tions are also possible,
since the vertical recepta-
cles also mate with non-
latching right angle headers
(page 95) and the vertical
headers also mate with non-
latching cable connectors.
Available are dual-row,
vertical shrouded headers
and receptacles in sizes
ranging from 10 through
100 positions (in 10 position
increments).
Parallel board-to-board
stack heights of 6.35 [.250],
8.13 [.320] and 9.91 [.390]
are achievable by selection
of the appropriate header.
The receptacle is the same
for all three stack height
headers.
Non-protrusive metallic
holddowns are designed for
use in 1.57 [.062] or thicker
(Continued)
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
PC boards and allow sur-
face mounting to both sides
of the board. In addition to
providing retention during
processing, the holddowns
are soldered during reflow
and therefore provide long
term strain relief for the lead
solder joints.
AMPMODU 50/50 Grid
Vertical Headers and
Receptacles are compatible
with standard surface-
mount processes; IR
(infrared) and VPR (vapor
phase reflow). The surface-
mount connectors have
been designed so that
dimensioning, tolerances,
referenced datums, hold-
Non-Protrusive
Metallic Holddowns
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
down characteristics and
packaging methods result
in a system that is compati-
ble with robotic assembly.
The headers and recepta-
cles feature polarization to
prevent misalignment.
Three Board Stack Heights
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967
[.390
[.250
[.320
9.91
6.35
8.13
± 0.15
± .006
± 0.15
± .006
± 0.15
± .006
]
]
]
89