643813-4 TE Connectivity, 643813-4 Datasheet - Page 75

• Manufacturer Part Number: 643813-4
• Description: Conn IDC Connector F 4 POS 2.54mm IDT RA Cable Mount Loose Piece
• Manufacturer: TE Connectivity
• Type: IDC Connectorr
• Series: MTA-100r

Specifications of 643813-4

• Pitch: 2.54 mm
• Number Of Rows: 1
• Number Of Contacts: 4
• Gender: F
• Contact Plating: Tin-Lead Over Nickel
• Termination Method: IDT
• Connector Type: Wire To Board
• Contact Termination: IDC / IDT
• No. Of Contacts: 4
• No. Of Rows: 1
• Pitch Spacing: 2.54mm
• Rohs Compliant: No
• Agency Approvals: CSA, UL
• Angle: Right
• Application: Wire-to-board
• Brand/series: MTA-100 Series
• Cable Exit Angle: 90 °
• Color: Red
• Color, Housing: Red
• Contact Centerline Spacing: 0.100 in.
• Contact Mating Area Plating: Tin-Lead
• Contact Termination Area Plating: Tin-Lead
• Current, Rating: 5 A
• Diameter, Insulation: 0.06 "
• Flammability Rating: UL94V-2
• Length, Overall: 0.4 "
• Material, Contact: Copper Alloy
• Material, Housing: Nylon
• Number Of Positions: 4
• Pin Spacing: 0.1 "
• Primary Type: Interconnect System
• Special Features: Closed End
• Standards: UL 94V-2 Housing Flammability Rating
• Temperature, Operating: -55 to +105 °C
• Termination: IDC
• Voltage, Rating: 250 V
• Wire Size: 22 AWG
• Wire, Awg: 22
• Connector Design: Closed End
• Product Line: MTA-100
• Termination Method To Wire/cable: IDC Standard
• Wire Size (mm² [awg]): 0.3-0.4² [22]
• Mating Connector Lock: With
• Four Points Of Contact: Without
• Shrouded: No
• Mounting Ears: Without
• Panel Mount Retention: Without
• Voltage Rating (vac): 250
• Solder Tail Contact Plating: Tin-Lead
• Centerline (mm [in]): 2.54 [0.100]
• Narrow: No
• Post Number(s) Omitted: None
• Contact Type: Socket
• Contact Plating, Mating Area, Material: Tin-Lead
• Contact Base Material: Copper Alloy
• Connector Style: Receptacle
• Housing Color: Red
• Mating Alignment: With
• Ul Flammability Rating: UL 94V-2
• Housing Material: Nylon
• Mating Alignment Type: Polarizing Tab
• Rohs/elv Compliance: Not ELV/RoHS compliant
• Lead Free Solder Processes: Not relevant for lead free process
• Applies To: Wire/Cable
• Application Use: Wire-to-Board
• Packaging Method: Loose Piece

Conductor
Insulation will be contained
within the confines of the
insulation strain relief as indicated
Bare wires
will not extend
above top of contact
Contact
Top of
A
Insulation Strain Relief
B Min.
Conductor
Bare wires will not be visible
beyond back of housing
Centerline of Conductor
Back of Housing