535541-4 TE Connectivity, 535541-4 Datasheet - Page 36

• Manufacturer Part Number: 535541-4
• Description: Conn Socket Strip RCP 6 POS 2.54mm Solder ST Thru-Hole Gang of Tubes
• Manufacturer: TE Connectivity
• Type: Socket Stripr
• Series: AMPMODU Mod IVr

Specifications of 535541-4

• Pitch: 2.54 mm
• Number Of Rows: 1
• Number Of Contacts: 6
• Gender: RCP
• Contact Plating: Gold Over Nickel
• Termination Method: Solder
• Pitch Spacing: 2.54mm
• No. Of Rows: 1
• No. Of Contacts: 6
• Contact Termination: Through Hole
• Contact Material: Phosphor Bronze
• Rohs Compliant: No
• Product Type: Connector
• Connector Series: Mod IV
• Profile: Low
• Mounting Pattern (mm [in]): 2.54 [.100]
• Sealed: No
• Holddown Feature: Without
• Pcb Mounting Orientation: Vertical
• Pcb Mount Retention: With
• Termination Method To Pc Board: Through Hole - Solder
• Closed Entry: With
• Board Standoff: With
• Stackable: Yes
• Contact - Rated Current (a): 2
• Contact Resistance (m?): 12
• Insulation Resistance (m?): 5,000
• Dielectric Withstanding Voltage (v): 750
• Termination Post Length (mm [in]): 3.18 [0.125]
• Solder Tail Contact Plating: Tin-Lead over Nickel
• Connector Height (mm [in]): 6.22 [0.245]
• Number Of Positions: 6
• Centerline, Matrix (mm [in]): 2.54 [.100]
• Pcb Mount Retention Type: Retention Solder Tails
• Contact Plating, Mating Area, Material: Gold (30)
• Contact Base Material: Phosphor Bronze
• Contact Configuration: Short Point
• Housing Entry Style: Top
• Housing Material: Polyester PCT
• Ul Flammability Rating: UL 94V-0
• Housing Color: Black
• Government/industry Qualification: No
• Rohs/elv Compliance: Not ELV/RoHS compliant
• Lead Free Solder Processes: Wave solder capable to 240°C
• Approved Standards: UL E28476, CSA LR7189
• Operating Temperature (°c): -65 – +105
• High Temperature Compatible: No
• Packaging Method: Gang of Tubes

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Catalog 1307819
Revised 8-08
www.tycoelectronics.com
Product Facts
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High density; contacts
spaced on .050 x .100
[1.27 x 2.54] centers
Right-angle and vertical
styles
Single row; select sizes 5
thru 50 positions
Double row; select sizes 10
thru 100 positions
Contacts are selectively
plated with gold
Stand-offs for removal of
solder flux
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
AMPMODU Interconnection System
Thru-Hole Receptacles, .050 x .100 [1.27 x 2.54] Centerline,
Board-to-Board
The AMPMODU System 50
thru-hole receptacles offer
a wide variety of high
density board-to-board
connectors. The .050 [1.27]
spacing between each
contact provides an
extremely dense
interconnect package and
results in a more efficient
use of the printed circuit
board space.
AMPMODU System 50
thru-hole receptacles are
available in right-angle and
vertical configurations and
are composed of single
and double row versions.
The single row versions are
available in select sizes of
5 thru 50 positions and
double row in positions
from 10 thru 100.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
Receptacle contacts and
mating .015 [0.38] square
posts are formed from high
conductivity copper alloy
and are selectively plated
with gold for higher
performance and reliability.
The receptacle housings
are made of black
thermoplastic, with a 94V-0
rating to withstand high
temperatures of reflow
soldering and incorporate
stand-offs for free drainage
of flux cleaning solutions.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208