104652-7 TE Connectivity, 104652-7 Datasheet - Page 2

• Manufacturer Part Number: 104652-7
• Description: Conn Socket Strip RCP 70 POS 1.27mm Solder ST SMD Tube
• Manufacturer: TE Connectivity
• Type: Socket Stripr
• Series: AMPMODU 50/50 Gridr

Specifications of 104652-7

• Pitch: 1.27 mm
• Number Of Rows: 2
• Number Of Contacts: 70
• Gender: RCP
• Contact Plating: Gold Over Nickel
• Termination Method: Solder
• Pitch Spacing: 1.27mm
• No. Of Contacts: 70
• No. Of Rows: 2
• Contact Termination: Surface Mount Vertical
• Rohs Compliant: No
• Connector Type: Connector Assembly
• Mount Angle: Vertical
• Pcb Mount Retention: With
• Mating Connector Lock: Without
• Hold-down Post Material: Copper Alloy
• Hold-down Post Plating: Tin-Lead (150) over Nickel (50)
• Insulation Resistance (m?): 5,000
• Voltage (vac): 30
• Dielectric Withstanding Voltage (v): 300
• Contact - Rated Current (a): 1 – 4
• Solder Tail Contact Plating: Tin-Lead (150)
• Number Of Positions: 70
• Pcb Mount Retention Type: Hold Down Post(s)
• Contact Base Material: Copper Alloy
• Contact Plating, Mating Area, Material: Gold (30)
• Underplate Material: Nickel
• Connector Style: Receptacle
• Mating Alignment: With
• Mating Alignment Type: Polarizing Tab
• Housing Material: Thermoplastic - GF
• Ul Flammability Rating: UL 94V-0
• Housing Color: Black
• Rohs/elv Compliance: ELV compliant, 5 of 6 Compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C, Reflow solder capable to 260°C
• Approved Standards: UL E28476, CSA LR7189
• Temperature Range (°c): -65 – +105
• Packaging Method: Tube

Product Facts
See Catalog 1307819 for
additional AMPMODU product
offerings.
Catalog 889092
Revised 9-06
www.tycoelectronics.com
Surface-mount products for
parallel board-to-board
applications, as well as
right angle board-to-board
and cable-to-board
applications
High density 1.27 x 1.27
[.050 x .050] centerline grid
Three board-to-board stack
heights: 6.35 [.250], 8.13
[.320] and 9.91 [.390]
Non-protrusive metallic
holddowns
Reliable dual beam
receptacle contacts for
redundant contact
Duplex plated receptacle
and post contacts; gold
plated on mating areas,
tin-lead plated on tails
Compatible with standard
surface-mount processing
(VPR and IR)
Receptacle and header
allow for drainage of
processing fluids
Tape and reel packaging
available, contact
Tyco Electronics for details
Polarized header and
receptacle assemblies
Sizes of 10, 20, 30, 40, 50,
60, 70, 80 and 100 positions
Recognized under the
Component Program of
Underwriters
Laboratories Inc.,
File No. E28476
Certified by Canadian
Standards
Association
File No. LR7189
R
Dimensions are in millimeters
and inches unless otherwise
specified. Values in brackets
are standard equivalents.
R
Fine Pitch SMT Stacking Connectors
(Parallel Board-to-Board)
Page_Head
AMPMODU 50/50 Grid Connectors
AMPMODU 50/50 Grid
Vertical Headers and
Receptacles are designed
for parallel board-to-board
stacking in high density
applications.
Right angle board-to-board
and cable-to-board applica-
tions are also possible,
since the vertical recepta-
cles also mate with non-
latching right angle headers
(page 95) and the vertical
headers also mate with non-
latching cable connectors.
Available are dual-row,
vertical shrouded headers
and receptacles in sizes
ranging from 10 through
100 positions (in 10 position
increments).
Parallel board-to-board
stack heights of 6.35 [.250],
8.13 [.320] and 9.91 [.390]
are achievable by selection
of the appropriate header.
The receptacle is the same
for all three stack height
headers.
Non-protrusive metallic
holddowns are designed for
use in 1.57 [.062] or thicker
(Continued)
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
PC boards and allow sur-
face mounting to both sides
of the board. In addition to
providing retention during
processing, the holddowns
are soldered during reflow
and therefore provide long
term strain relief for the lead
solder joints.
AMPMODU 50/50 Grid
Vertical Headers and
Receptacles are compatible
with standard surface-
mount processes; IR
(infrared) and VPR (vapor
phase reflow). The surface-
mount connectors have
been designed so that
dimensioning, tolerances,
referenced datums, hold-
Non-Protrusive
Metallic Holddowns
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
down characteristics and
packaging methods result
in a system that is compati-
ble with robotic assembly.
The headers and recepta-
cles feature polarization to
prevent misalignment.
Three Board Stack Heights
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967
[.390
[.250
[.320
9.91
6.35
8.13
± 0.15
± .006
± 0.15
± .006
± 0.15
± .006
]
]
]
89