204511-1 TE Connectivity, 204511-1 Datasheet - Page 2

• Manufacturer Part Number: 204511-1
• Description: Conn High Density D-Sub PIN 104 POS Crimp ST Cable Mount 104 Terminal 1 Port
• Manufacturer: TE Connectivity
• Type: High Density D-Subr
• Series: 90r

Specifications of 204511-1

• Gender: PIN
• Termination Method: Crimp
• Mounting: Cable Mount
• Body Orientation: Straight
• Connector Type: D Sub
• No. Of Contacts: 104
• Connector Body Material: Metal
• Contact Termination: Crimp
• Peak Reflow Compatible (260 C): No
• Leaded Process Compatible: No
• Rohs Compliant: No
• Angle: Straight
• Application: True Mil
• Brand/series: 90
• Finish, Housing: Cadmium
• Material, Housing: Steel
• Number Of Contacts: 104
• Number Of Rows: 5
• Primary Type: D-Subminiature
• Shell Size: 6
• Standards: MIL-C-24308
• Strain Relief: Straight
• Termination: Crimp

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204511-1 Product Details - Tyco Electronics
Product Type Features:
Body Related Features:
2007 Tyco Electronics Corporation All Rights Reserved
http://catalog.tycoelectronics.com/TE/bin/TE.Connect?C=1&M=BYPN&TCPN=204511-1&RQPN=204511-1 (2 of 2)11/20/2007 6:29:38 PM
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Customer Support
Product Type
Product Series
Number of Positions
Gender
Shell Size
Shell Material
Wire Termination Type
Mounting Hole Diameter (mm [in]) = 3.05 [.120]
Comment = "F" is stamped on connectors following M24308 part number as
required. "F" designates cadmium shell plating.; Size 22 pins supplied with
plugs are loose piece.
Blindmate
Non-Magnetic
Pins
Rear Grommet
Power/Signal/Coax Combination
Shell Plating
Mount Style = Mounting Holes
Retention Clip Material = Stainless Steel
= Without
= Plug
= 6
= No
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= Cadmium
Suppliers
= Connector
Contact Customer Support
= Steel
= 90
= No
= No
= 104
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= Crimp
Site Map
= No
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Privacy Policy
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Browser Support
Contact Related Features:
Configuration Related Features:
Industry Standards:
Conditions for Usage:
Other:
Contact Size
Contact Style
Density
Government/Industry Qualification = Yes
Government/Industry Part Number = M24308/4-269F
RoHS/ELV Compliance
Lead Free Solder Processes
capable to 260°C, Wave solder capable to 265°C, Reflow solder capable to
245°C, Reflow solder capable to 260°C, Pin-in-Paste capable to 245°C, Pin-in-
Paste capable to 260°C
NASA Qualification = No
Terminate To = Wire
Brand = AMP
= High
= 22
= Crimp Snap-in
= Not ELV/RoHS compliant
= Wave solder capable to 240°C, Wave solder