BBY 53-03W E6327 Infineon Technologies, BBY 53-03W E6327 Datasheet

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BBY 53-03W E6327

Manufacturer Part Number
BBY 53-03W E6327
Description
DIODE TUNING 6V 20MA SOD-323
Manufacturer
Infineon Technologies
Datasheet

Specifications of BBY 53-03W E6327

Package / Case
SOD-323
Capacitance @ Vr, F
3.1pF @ 3V, 1MHz
Capacitance Ratio
2.6
Capacitance Ratio Condition
C1/C3
Voltage - Peak Reverse (max)
6V
Diode Type
Single
Mounting Type
Surface Mount
Capacitance
4.8 pF
Reverse Voltage
6 V
Configuration
Single
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 55 C
Minimum Tuning Ratio
1.8
Mounting Style
SMD/SMT
Tuning Ratio Test Condition
1 / 3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Q @ Vr, F
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
BBY5303WE6327XT
SP000010461
Silicon Tuning Diode
BBY53-02L
BBY53-02V
BBY53-02W
BBY53-03W
Type
BBY53
BBY53-02L
BBY53-02V
BBY53-02W
BBY53-03W
BBY53-05W
Maximum Ratings at T
Parameter
Diode reverse voltage
Forward current
Operating temperature range
Storage temperature
1
Pb-containing package may be available upon special request
High Q hyperabrupt tuning diode
Designed for low tuning voltage operation
High ratio at low reverse voltage
Pb-free (RoHS compliant) package
Qualified according AEC Q101
for VCO's in mobile communications equipment
BBY53
BBY53-05W
A
= 25°C, unless otherwise specified
Package
SOT23
TSLP-2-1
SC79
SCD80
SOD323
SOT323
1)
Configuration
common cathode
single, leadless
single
single
single
common cathode
1
Symbol
V
I
T
T
F
op
stg
R
-55 ... 125
-55 ... 150
Value
20
L
6
S
0.4
0.6
0.6
1.8
1.4
(nH)
2
2007-09-18
BBY53...
Marking
S7s
LL
L
LL
white/5
S7s
Unit
V
mA
°C

Related parts for BBY 53-03W E6327

BBY 53-03W E6327 Summary of contents

Page 1

Silicon Tuning Diode High Q hyperabrupt tuning diode Designed for low tuning voltage operation for VCO's in mobile communications equipment High ratio at low reverse voltage Pb-free (RoHS compliant) package Qualified according AEC Q101 BBY53-02L BBY53 BBY53-02V BBY53-05W BBY53-02W BBY53-03W ...

Page 2

Electrical Characteristics at T Parameter DC Characteristics Reverse current ° Characteristics Diode capacitance MHz ...

Page 3

Diode capacitance 1MHz 0.5 1 1.5 Temperature coefficient of the diode capacitance ...

Page 4

Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch) Reel ø330 mm = 10.000 Pieces/Reel Standard 4 0.4 Cathode marking 0.93 Package SC79 0.2 M ...

Page 5

Package Outline Cathode marking Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch) Reel ø330 mm = 10.000 Pieces/Reel Standard 4 Cathode marking Package SCD80 0.2 A ...

Page 6

Date Code marking for discrete packages with one digit (SCD80, SC79, SC75 Month ...

Page 7

Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel Cathode marking Package SOD323 +0.2 0.9 -0.1 +0.2 1.25 0 -0.1 ±0.05 2 Cathode marking 1 +0.1 0.3 -0.05 ...

Page 8

Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel Pin 1 Package SOT23 2.9 ±0 +0.1 0.4 -0.05 C 0.95 1.9 0.25 B ...

Page 9

Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel Package SOT323 2 ±0.2 0.1 MAX. +0.1 3x 0.3 -0.05 0 0.65 0.65 0.2 0.6 ...

Page 10

Package Outline Top view 2 1 Cathode marking 1) Dimension applies to plated terminal Foot Print For board assembly information please refer to Infineon website "Packages" Copper Marking Layout (Example) Standard Packing Reel ø180 mm = 15.000 Pieces/Reel Reel ø330 ...

Page 11

... For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies failure of such components can reasonably be expected to cause the failure of that life-support device or system affect the safety or effectiveness of that device or system ...

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