MCL2AHTTE082K KOA Speer Electronics, MCL2AHTTE082K Datasheet - Page 6

• Manufacturer Part Number: MCL2AHTTE082K
• Description: Power Inductors 0.082uH 10%
• Manufacturer: KOA Speer Electronics
• Series: MCLr

Specifications of MCL2AHTTE082K

• Product: Inductors
• Inductance: 82 nH
• Tolerance: 10 %
• Maximum Dc Current: 300 mAmps
• Maximum Dc Resistance: 0.2 Ohms
• Self Resonant Frequency: 255 MHz
• Dimensions: 1.25 mm W x 2 mm L x 0.9 mm H
• Shielding: Shielded
• Operating Temperature Range: - 55 C to + 125 C
• Termination Style: SMD/SMT
• Package / Case: 0805 (2012 metric)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

250°C
150°C
7. Dimensions - inches (mm)
8. Chip Quantities Per Reel
* MCL0805: 2.7µH ~ 12µH = 2K
10. Recommended Temperature Profiles for Soldering
Bolivar Drive
Spec ific ation s g iven herein m ay be cha nged a t any tim e w itho ut pr ior not ice. Pleas e c onf ir m te chnic al s pec if ica tions before you order an d/or u se.
250°C
150°C
Tape
Tape
2A
2B
2A
2B
1J
1J
Chip Size
Preheat 100
Seconds Max.
2A
2B
1J
Preheat 100
Seconds Max.
0.043±0.002
0.063±0.002
0.071±0.002
0.069±0.004
(1.75±0.10)
Recommended Temperature Profile
(1.1±0.1)
(1.6±0.1)
(1.8±0.1)
0.047µH ~ 2.2µH = 4K
60 Seconds Max.
Recommended Temperature Profile
Ao
E
60 Seconds Max.
P.O. Box 547
for Wave Soldering
7 inch (178mm) Reel
for Wave Soldering
0.075±0.002
0.093±0.002
0.138±0.002
0.138±0.002
(3.50±.005)
* 2,000/4,000
10 Seconds Max.
(1.9±0.1)
(2.4±0.1)
(3.5±0.1)
Parts on
10 Seconds Max.
4,000
3,000
Bo
Soldering
F
Soldering
Bradford, PA 16701
0.043±0.002
0.046±0.002
0.048±0.002
0.318±0.002
(1.1±0.1)
(1.2±0.1)
(1.2±0.1)
(8.1±0.1)
Ko
W
Natural
Cooling
Natural
Cooling
0.157±0.004
(4.0±0.1)
9. Recommended PC Board Land Patterns - inches (mm)
W
P
Chip Size
1
E
F
230°C
150°C
2A
2B
1J
USA
230°C
150°C
0.157±0.004
(4.0±0.1)
Do
Preheat 100
Seconds Max.
Po
814-362-5536
Preheat 100
Seconds Max.
0.173 (4.4)
0.102 (2.6)
0.118 (3.0)
D
1
Recommended Temperature Profile
60 Seconds Max.
Recommended Temperature Profile
L
0.079±0.002
60 Seconds Max.
(2.00±0.05)
Po
for Reflow Soldering
G
L
P
for Reflow Soldering
2
10 Seconds Max.
0.022 (0.55)
0.026 (0.66)
0.059 (1.5)
Fax [phone]
10 Seconds Max.
Soldering
P
(1.5+0.1/-0.0)
0.059±0.004
1
G
20 Seconds Max.
Soldering
20 Seconds Max.
Do
0.037 (0.94)
0.057 (1.45)
0.071 (1.8)
H
P
2
200°C
0.039 min.
Natural
Cooling
(1.0 min.)
Ao
H
200°C
Natural
Cooling
D
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Bo
0.009±0.001
(0.23±0.02)
SS-223 R9
t
Ko
t