145154-4 TE Connectivity, 145154-4 Datasheet - Page 94

• Manufacturer Part Number: 145154-4
• Description: Conn PCI Express Card SKT 120 POS 1.27mm Solder ST Thru-Hole
• Manufacturer: TE Connectivity
• Type: PCI Express Cardr

Specifications of 145154-4

• Number Of Contacts: 120
• Contact Plating: Gold Over Nickel
• Mounting: Through Hole
• Termination Method: Solder
• Pitch: 1.27 mm
• Number Of Rows: 2
• Number Of Contact Rows: 2
• Body Orientation: Straight
• Contact Material: Phosphor Bronze
• Mounting Style: Through Hole
• Product Height (mm): 15.49mm
• Operating Temp Range: -55C to 85C
• Pitch (mm): 1.27mm
• Housing Material: Thermoplastic
• Housing Color: White
• Current Rating (max): 1/ContactA
• Voltage Rating Max: 203VAC
• Contact Resistance Max: 20
• Connector Type: Card Edge
• Row Pitch: 2.54mm
• Pitch Spacing: 1.27mm
• No. Of Contacts: 120
• Gender: Receptacle
• Contact Termination: Through Hole Vertical
• No. Of Rows: 2
• Rohs Compliant: No
• Pcb Mounting Orientation: Vertical
• Number Of Dual Positions: 60
• Pcb Mount Style: Through Hole
• Termination Post Length (mm [in]): 2.54 [0.100]
• Solder Tail Contact Plating: Tin-Lead over Nickel
• Number Of Positions: 120
• Centerline (mm [in]): 1.27 [0.050]
• Bus Width: 32 Bit
• Pcb Mount Retention Type: Pylon
• Ejector: Without
• Number Of Pylons: 2
• Pylon Material: Plastic
• Family Name: PCI
• Contact Plating, Mating Area, Material: Gold (30)
• Contact Base Material: Phosphor Bronze
• Rohs/elv Compliance: ELV compliant, 5 of 6 Compliant
• Lead Free Solder Processes: Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
• Lead Free Status / RoHS Status: Not Compliant

94
AMP ACTION PIN
Press-Fit Contacts
PC Board Thickness
ACTION PIN contacts are
designed for use in a variety of
PC board thicknesses. However,
certain ACTION PIN contacts
are to be used in specific ranges
of board thicknesses. To
promote optimum performance,
the recommended board thick-
nesses provided with the con-
nector being used must be
followed.
ACTION PIN Contact/PC Board Applications
*Maximum hardness of copper layer is 150 Knoop.
Note: Recommended annular ring diameter is hole diameter plus .020 [0.51].
Catalog 1654080
Issued 7-03
www.tycoelectronics.com
Connector
Linear ZIF
Type
Material Thickness
ACTION PIN
Contact
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
.025
0.64
Card Edge Connectors
(Solder Type, Board-to-Board)
Linear ZIF Connectors
Drilled Hole
Diameter
.0453
1.151
±.001
±0.03
ACTION PIN contacts provide a reliable press-fit connection.
Localized pressure in the interface area entails oxide
break-through and helps prevent corrosion in the harshest
environments to provide a reliable connection virtually every
time. Also, radial and axial distortion are controlled to meet
today’s standards for multilayer board applications.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
Copper *
.001-.003
0.03-0.08
Plating Thicknesses
(Continued)
Tin-Lead
.0003
0.008
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
Min.
Through-Hole
Diameter
.037-.043
0.94-1.09
Plated
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967
Specified
Average
Radial Hole Distortion
Not
Annular Ring (See Note)
Drilled Hole
Copper Thickness
Tin-Lead Thickness
Plated Through-Hole
Maximum
Specified
Not