5536649-1 TE Connectivity, 5536649-1 Datasheet - Page 27

• Manufacturer Part Number: 5536649-1
• Description: Conn Backplane RCP 10Power POS 2mm Press Fit RA Thru-Hole
• Manufacturer: TE Connectivity
• Type: Backplaner
• Series: Z-PACKr

Specifications of 5536649-1

• Pitch: 2 mm
• Number Of Rows: 5
• Number Of Contacts: 10Power
• Termination Method: Press Fit
• Mounting: Through Hole
• Contact Plating: Gold Over Nickel
• Pitch (mm): 2mm
• Gender: RCP
• Body Orientation: Right Angle
• Number Of Contact Rows: 5
• Mounting Style: Through Hole
• Voltage Rating Max: 30VAC
• Current Rating (max): 5/ContactA
• Contact Material: Phosphor Bronze
• Housing Material: Liquid Cryst Polymer
• Product Height (mm): 13.8mm
• Product Depth (mm): 22.45mm
• Product Length (mm): 11.88mm
• Connector Type: Backplane
• Row Pitch: 2mm
• Pitch Spacing: 2mm
• No. Of Contacts: 10
• Contact Termination: Right Angle Through Hole
• No. Of Rows: 5
• Rohs Compliant: Yes
• Number Of Positions / Contacts: 10
• Mounting Angle: Right
• Termination Style: Press In
• Product Type: Connector
• Pcb Mounting Orientation: Right Angle
• Post Type: Solder Post
• Module Type: Power
• Number Of Power Positions: 10
• Voltage Rating (vac): 30
• Termination Post Length (mm [in]): 3.56 [0.140]
• Sequencing: No
• Post Plating: Tin
• Centerline, Matrix (mm [in]): 2.00 x 2.00 [.079 x .079]
• Contact Type: Socket
• Contact Base Material: Phosphor Bronze
• Contact Plating, Mating Area, Material: Gold (30)
• Connector Style: Receptacle
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Not relevant for lead free process
• Rohs/elv Compliance History: Always was RoHS compliant
• Applies To: Printed Circuit Board
• Application: Free-Board
• Lead Free Status / RoHS Status: Compliant
• Lead Free Status / RoHS Status: Compliant

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Product Facts
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Contact Blades
Product Facts
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Technical Documents
Product Specification
108-2253
Application Specification
114-13182
Industry Standard
PICMG MicroTCA R1.0
MicroTCA and PICMG are trademarks of
PICMG-PCI Industrial Computer
Manufacturers Group, Inc.
Catalog 1773096
Revised 2-10
www.tycoelectronics.com
Designed to the PICMG
MicroTCA.0 Standard
30 microinches gold plating
over nickel
RoHS compliant
24 high current density
power contacts, able to
carry up to 14.5 Amps per
contact when fully loaded
Industry proven Universal
Power Module (UPM) power
contacts
Hot-plug contact design
controls arc during hot
mate/unmate cycles
3 mating levels
Designed for Hot Swap
applications
Extended sacrificial contact
tip absorbs arc
Main contacts stay free of
contaminants
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
Power Connectors & Interconnection Systems
MINIPAK HD Connectors
Tyco Electronics supplies
the Power Entry Module
(PEM) connector specified
in the PICMG MicroTCA
Standard. The PICMG
MicroTCA.0 Standard is
one of the latest standards
addressing future
telecommuni cations needs.
The MINIPAK HD connector
combines 24 power con-
tacts and 72 high density
signal contacts. The power
contacts are the industry
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
MINIPAK HD Contact Blades
proven contacts utilized in
the Universal Power Module
(UPM) and are capable of
carrying 14.5 Amps per
contact when fully ener-
gized. Rugged contact
design ensures long-term
reliability and sacrificed
contact tip, controls arcing
during hot mate/unmate
cycles. The MINIPAK HD
also features 3 levels of
mating and selective gold
plating on contacts.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-(0)8002-67666