646445-1 TE Connectivity, 646445-1 Datasheet - Page 6
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646445-1
Manufacturer Part Number
646445-1
Description
Conn Hard Metric RCP 200 POS 2mm Solder RA Thru-Hole
Manufacturer
TE Connectivity
Type
Hard Metricr
Series
Z-PACKr
Specifications of 646445-1
Pitch
2 mm
Number Of Rows
8
Number Of Contacts
200
Termination Method
Solder
Mounting
Through Hole
Contact Plating
Gold Over Nickel
Pitch (mm)
2mm
Gender
RCP
Body Orientation
Right Angle
Number Of Contact Rows
8
Mounting Style
Through Hole
Contact Material
Phosphor Bronze
Housing Color
Gray
Housing Material
Polyester
Product Height (mm)
17.4mm
Product Depth (mm)
22.4mm
Product Length (mm)
49.9mm
Connector Type
Hard Metric (HM)
Row Pitch
2mm
Pitch Spacing
2mm
No. Of Contacts
200
Contact Termination
Right Angle Press Fit
No. Of Rows
8
Rohs Compliant
Yes
Product Type
Female
Number Of Positions / Contacts
200
Termination Style
Press Fit
Pcb Mounting Orientation
Right Angle
Board Mount
Free Board
Module Length (mm [in])
48.00 [1.891]
Crosstalk Version
Standard
Amp Standard Option Number
1
Shielded
No
Interface Type
2mm HM
Termination End Plating
Tin-Lead over Nickel
Number Of Positions
200
Grounding Contact
Without
Rows Loaded
A, B, E, F, D, C, G, H
Contact Configuration
ACTION PIN Post, Signal
Feedthrough Post Length (mm [in])
3.30 [0.130]
Compactpci
Yes
Contact Plating, Mating Area, Material
Gold (30)
Contact Base Material
Phosphor Bronze
Connector Style
Receptacle
Mating Alignment
With
Mating Alignment Type
Multi-Purpose Center
Ul Flammability Rating
UL 94V-0
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Not relevant for lead free process
Rohs/elv Compliance History
Always was RoHS compliant
Lead Free Status / RoHS Status
Compliant
Lead Free Status / RoHS Status
Compliant
6
Product Characteristics
Electronic developments are
increasing the demands on
system performance, and
connectors can no longer
be considered as discrete
components but as part of a
total electrical/electronic
design. These aspects can
include the following:
Higher pin count within tight
space constraints.
With 25 and 40 signal pins
per cm of 5 row and 8 row
connectors respectively, high
densities can be achieved,
or low signal to ground
ratios specified within tight
space constraints.
Minimum reflections
Matched impedance
between cables, connectors
and systems give low reflec-
tions at interfaces. This is
achieved with overmolded
receptacle contacts which
give impedances close to
the values of printed circuit
boards, maximizing effec-
tive signal strength.
Reduced crosstalk
Crosstalk can be minimized
by selective use of ground
pins between signals,
which can be augmented
by the use of ground return
shields. Reduced cross talk
versions of the receptacle
connector provide partial
shielding between columns.
Catalog 65911
Revised 7-05
www.tycoelectronics.com
Dimensions are in millimeters
and inches unless otherwise
specified. Values in brackets
are standard equivalents.
AMP Z-PACK 2mm HM Hard Metric
Interconnection System
Product Characteristics and System Features
Shielding
Upper and/or lower ground
return shields are used with
5+2 and 8+2 row headers
to improve signal integrity.
EMI / RFI shields are avail-
able to totally enclose 5 row
connectors to give maxi-
mum immunity from, and
minimum emission of, radi-
ated noise.
Reduced Skew
The design of right angle
connectors achieves very
low skew between longest
and shortest contact and
board paths, corrected for
board effects. The actual
value varies between 5 row
and 8 row types.
Fiber Optic Connections
As well as the normal
power and coaxial DIN con-
tacts, either DIN fiber optic
or AMP MSC fiber optic
connectors can be included
in backplane systems for
high speed data transfer
without risk of corruption.
Upgradeability
The system is upgradeable
to give enhanced perform-
ance as system demands
increase. This allows eco-
nomical selection of compo-
nents initially with enhanced
version selectable as per-
formance levels increase
without a major change in
connector design or board
layout. Tyco Electronics rec-
ommends that board layouts
include ground return shield
holes for future-proofing.
reference purposes only.
Dimensions are shown for
Specifications subject
to change.
System Features
Termination
All versions use
AMP ACTION PIN press fit
contacts, giving high reten-
tion force termination con-
forming to IEC 352-5.
Pin Headers
Contact pins are available
to give three mating levels
on the front face with stan-
dard 3.7 [.146] tail, suitable
for boards from 1.4 to 4.3
[.055 - .169] thick.
Feedthrough vertical head-
ers offer three levels of mat-
ing to rear of backplane for
midplane and cable con-
nection with special twisted
pins used for cross connect
applications. A wide variety
of standard product exists
which offer economy and
short lead times, but any
variation of selective load
can be offered.
Receptacle Assemblies
Receptacle assemblies
employ a 'chiclet' assembly
principle allowing a variety
of selective loading and
providing the ability to fit
reduced cross talk shields.
Enhanced versions are pre-
fitted with upper shields,
with lower shields applied
separately as required.
Power Connection
Universal Power Module
Connectors are press fit
three position connectors
with the option of three
levels of sequencing and
23A rating.
Alternatively, DIN contacts
can be used in type L ,M
and N housings with con-
tact rating up to 40A and
first make/last break option.
Variations of cable-to-
board, board-to-board and
cable-to-cable are offered.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
Coaxial Connection
DIN coax contacts can be
fitted to type L, M and N
housings in cable and
board mount versions.
Fiber Optic Connections
DIN style contacts can
be fitted to housings as
above or higher density
AMP MSC contacts to MSC
housings.
Spice Models
To achieve optimum
performance and cost,
it is essential to accurately
match connector and
system parameters. Where
customers wish to carry
out their own analysis,
Tyco Electronics offers sin-
gle and multi-line models
for many connector styles.
Please ask for details of the
packages available.
Modelling Support
Tyco Electronics offers a
structured approach to the
design and evaluation of
packaging and intercon-
nection systems, including
a full range of electrical
and mechanical support
functions.
Using accurate device
models, our capabilities
include high speed signal
propagation analysis using
SPICE modelling, and simu-
lation of interconnections
and backplane designs.
Complete power distribution
and thermal analysis can
also be included.
System Manufacture
Tyco Electronics Circuits
and Packaging Division
specializes in the design
and manufacture of high
performance backplanes
and subsidiary boards.
They will design back-
planes and boards to meet
your performance criteria,
bringing their experience
and tools to enhance your
design. Ask Tyco Electronics
for further details.
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967