5536504-2 TE Connectivity, 5536504-2 Datasheet - Page 9

• Manufacturer Part Number: 5536504-2
• Description: Conn Backplane PIN 48 POS 2mm Press Fit ST Thru-Hole
• Manufacturer: TE Connectivity
• Type: Backplaner
• Series: Z-PACKr

Specifications of 5536504-2

• Pitch: 2 mm
• Number Of Rows: 4
• Number Of Contacts: 48
• Termination Method: Press Fit
• Mounting: Through Hole
• Contact Plating: Gold Over Nickel
• Pitch (mm): 2mm
• Gender: Pin
• Body Orientation: Straight
• Number Of Contact Rows: 4
• Mounting Style: Through Hole
• Voltage Rating Max: 30VAC
• Contact Material: Phosphor Bronze
• Housing Color: Natural
• Housing Material: Liquid Cryst Polymer
• Product Height (mm): 17mm
• Product Depth (mm): 15.8mm
• Product Length (mm): 23.88mm
• Connector Type: Backplane
• Row Pitch: 2mm
• Pitch Spacing: 2mm
• No. Of Contacts: 48
• Contact Termination: Press Fit
• No. Of Rows: 4
• Contact: RoHS Compliant
• Number Of Positions / Contacts: 48
• Mounting Angle: Vertical
• Termination Style: Pin
• Product Type: Connector
• Pcb Mounting Orientation: Vertical
• Post Type: Press-Fit
• Module Type: Signal
• Mating Post Length (mm [in]): 6.50 [0.256]
• Press-fit Post Style: Compliant Pin
• Pin Header Width (mm [in]): 16.00 [0.622]
• Voltage Rating (vac): 30
• Termination Post Length (mm [in]): 4.25 [0.167]
• Number Of Signal Positions: 48
• Sequencing: No
• Post Plating: Tin
• Centerline, Matrix (mm [in]): 2.00 x 2.00 [.079 x .079]
• Contact Type: Pin
• Contact Base Material: Phosphor Bronze
• Contact Plating, Mating Area, Material: Gold (30)
• Connector Style: Plug
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Not relevant for lead free process
• Rohs/elv Compliance History: Always was RoHS compliant
• Applies To: Printed Circuit Board
• Application: Fixed-Board
• Lead Free Status / RoHS Status: Compliant
• Lead Free Status / RoHS Status: Compliant

3.6. Special Handling
Rev E
0.004--0.010
0.0005--0.004
0.0002--0.0005
0.0001--0.0005 Au,
0.00127--0.0076 Ni
0.0001--0.0005
C. Contact Hole Configuration
The contact holes in the pc board for all connectors must be prepared to the dimensions specified in
Figure 7.
THICKNESS
A. Initial Positioning
Prior to positioning a connector, the pc board should be placed on an appropriate board support fixture.
Connectors should be gripped by the housing only and not by the contacts. When placing a connector into
4- - ROW
264
240
216
192
168
144
120
------
96
72
48
24
NUMBER OF SIGNAL POSITIONS
0.65- - 0.80 (Ref)
Diameter of Finished
Hole After Plating
Hot Air Solder Leveling (HASL) Tin--Lead (Sn Pb)
Immersion Tin (Sn)
Organic Solderability Preservative (OSP)
Immersion Gold (Au) Over Nickel (Ni) (ENIG)
Immersion Silver (Ag)
0.81- - 0.86
Drilled Hole
Diameter
5- - ROW
630
540
330
300
270
240
210
180
150
120
90
60
30
SURFACE FINISH
Figure 6 (end)
Figure 7
PLATING
DIMENSION B
DIMENSION B
125
107
65
59
53
47
41
35
29
23
17
11
5
Surface Finish (See Table Below)
PC Board Thickness
(See Paragraph 3.5)
1.12 Min
Pad Diameter
0.025- - 0.050
Copper Plating
FR- - 4
Material
DIMENSION C
DIMENSION C
250
214
130
106
118
94
82
70
58
46
34
22
10
114- 1075
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