3-2106003-1 TE Connectivity, 3-2106003-1 Datasheet - Page 5
![no-image](/images/manufacturer_photos/0/6/654/te_connectivity_sml.jpg)
3-2106003-1
Manufacturer Part Number
3-2106003-1
Description
CONNECTOR, SMT-IDC, 1 POS, 24 AWG
Manufacturer
TE Connectivity
Specifications of 3-2106003-1
Connector Type
Wire To Board
Contact Termination
Surface Mount Horizontal
Gender
Receptacle
No. Of Contacts
1
No. Of Rows
1
Pitch Spacing
4mm
Contact Plating
Tin
Rohs Compliant
Yes
Connector Design
Closed End
Strain Relief
With
Sealed
No
Termination Method To Pc Board
Surface Mount
Pcb Mount Retention
With
Pcb Mount Alignment
Without
Smt Compatible
Yes
Mount Angle
Right Angle
Wire/cable Type
Discrete Wire
Termination Method To Wire/cable
IDC
Keyed
No
Make First / Break Last
No
Contact Current Rating, Max (a)
9
Operating Voltage (vac)
250
Operating Voltage (vdc)
250
Tail Orientation
Staggered
Wire/cable Size (awg)
24
Tool-less Wire Termination
Yes
Profile Height (y-axis) (mm [in])
5.80 [0.228]
Number Of Positions
1
Number Of Rows
1
Length (x-axis) (mm [in])
5.70 [0.224]
Width (z-axis) (mm [in])
7.75 [0.305]
Post-mating Assembly Measurement (mm [in])
5.7 [0.224]
Header Mating Direction
Horizontal
Pcb Mount Retention Type
Solder Pads
Strain Relief Type
Terminating Covers
Tail Plating Material
Matte Tin-Lead over Nickel
Tail Plating, Thickness (µm [?in])
5.08 [200]
Contact Plating, Mating Area, Material
Matte Tin
Contact Plating, Mating Area, Thickness (µm [?in])
5.08 [200]
Stamped And Formed
Yes
Housing Material
Liquid Crystal Polymer (LCP)
Housing Color
Natural
Ul Flammability Rating
UL 94V-0
Pre-designed Cables Available
No
Agency/standard
CSA, UL
Agency/standard Number
C22.2 No. 182.3-M1987, UL 1977
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
Rohs/elv Compliance History
Always was RoHS compliant
Circuit Identification Feature
Without
Operating Temperature (°c [°f])
-40 – +105 [-40 – +221]
Applies To
Printed Circuit Board
Accepts Wire Insulation Diameter, Range (mm [in])
1.45 [0.057]
Smt Soldering Temperature (°c [°f])
220 [428]
Lighting Interconnect Level
Level 1
Glow Wire Rating
No
Uv Exposure Rated
No
Application Use
Wire-to-Board
Packaging Method
SMT Pocket Tape
4.
4.1.
4.2.
4.3.
4.4.
Rev A
QUALITY ASSURANCE PROVISIONS
Qualification Testing
A.
B.
Requalification Testing
If changes significantly affecting form, fit or function are made to the product or manufacturing process,
product assurance shall coordinate requalification testing, consisting of all or part of the original testing
sequence as determined by development/product, quality and reliability engineering.
Acceptance
Acceptance is based on verification that the product meets the requirements of Figure 1. Failures
attributed to equipment, test setup or operator deficiencies shall not disqualify the product. If product
failure occurs, corrective action shall be taken and specimens resubmitted for qualification. Testing to
confirm corrective action is required before resubmittal.
Quality Conformance Inspection
The applicable quality inspection plan shall specify the sampling acceptable quality level to be used.
Dimensional and functional requirements shall be in accordance with the applicable product drawing
and this specification.
Specimen Selection
Specimens shall be prepared in accordance with applicable Instruction Sheets and shall be
selected at random from current production. Each test group shall consist of a minimum of 5
specimens.
Test Sequence
Qualification inspection shall be verified by testing specimens as specified in Figure 2.
LLCR Measurement Points
Figure 3
108-2404
5 of 7