CSPEMI607G ON Semiconductor, CSPEMI607G Datasheet - Page 6

• Manufacturer Part Number: CSPEMI607G
• Description: EMI/RFI Suppressors & Ferrites EMI/RFI Filter with ESD Protection
• Manufacturer: ON Semiconductor

Specifications of CSPEMI607G

• Product: EMI Filters
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
© 2009 California Micro Devices Corp. All rights reserved.
6
PARAMETER
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Maximum Soldering Temperature for a Lead-free Device using Lead-free Solder Paste
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Figure 3. Recommended Non-Solder Mask Defined Pad Illustration
PRINTED CIRCUIT BOARD RECOMMENDATIONS
Figure 4. Lead-free (SnAgCu) Solder Ball Reflow Profile
Non-Solder Mask Defined Pad
250
200
150
100
50
Solder Stencil Opening
Solder Mask Opening
0
0.275mm DIA.
0.330mm DIA.
0.325mm DIA.
1:00.0
●
Issue A – 08/4/09
Tel: [phone]
Time (minutes)
2:00.0
3:00.0
●
4:00.0
Fax: [phone]
Non-Solder Mask defined pads
OSP (Entek Cu Plus 106A)
0.125mm - 0.150mm
0.325mm Round
0.330mm Round
50/50 by volume
CSPEMI607G
●
60 seconds
0.275mm
No Clean
VALUE
+50μm
+20μm
Round
260°C
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