XC2VP30-6FFG1152C Xilinx Inc, XC2VP30-6FFG1152C Datasheet - Page 428

• Manufacturer Part Number: XC2VP30-6FFG1152C
• Description: FPGA Virtex-II Pro™ Family 30816 Cells 1200MHz 0.13um/90nm (CMOS) Technology 1.5V 1152-Pin FCBGA
• Manufacturer: Xilinx Inc
• Series: Virtex™-II Pror

Specifications of XC2VP30-6FFG1152C

• Package: 1152FCBGA
• Family Name: Virtex-II Pro™
• Device Logic Units: 30816
• Number Of Registers: 27392
• Maximum Internal Frequency: 1200 MHz
• Typical Operating Supply Voltage: 1.5 V
• Maximum Number Of User I/os: 644
• Ram Bits: 2506752
• Number Of Logic Elements/cells: 30816
• Number Of Labs/clbs: 3424
• Total Ram Bits: 2506752
• Number Of I /o: 644
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 1152-BBGA, FCBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Number Of Gates: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 122-1364

R
Virtex-II Pro and Virtex-II Pro X Platform FPGAs: Pinout Information
FF1696 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm pitch)
Figure 10: FF1696 Flip-Chip Fine-Pitch BGA Package Specifications
www.xilinx.com
DS083 (v4.7) November 5, 2007
Module 4 of 4
Product Specification
300