KIT3376MMA7368L Freescale, KIT3376MMA7368L Datasheet - Page 8
KIT3376MMA7368L
Manufacturer Part Number
KIT3376MMA7368L
Description
Manufacturer
Freescale
Datasheet
1.KIT3376MMA7368L.pdf
(11 pages)
Specifications of KIT3376MMA7368L
Lead Free Status / RoHS Status
Supplier Unconfirmed
PCB Mounting Recommendations
Board (PCB) reflow processes. For optimal zero-g offset after
PCB mounting, care must be taken to PCB layout and reflow
conditions. Reference application note AN3484 for best
practices to minimize the zero-g offset shift after PCB
mounting.
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package.
subjected to a solder reflow process. It is always
recommended to design boards with a solder mask layer to
avoid bridging and shorting between solder pads.
8
MMA7368L
MEMS based sensors are sensitive to Printed Circuit
Surface mount board layout is a critical portion of the total
With the correct footprint, the packages will self-align when
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
14x0.6
10x0.8
14x0.9
1
6
Freescale Semiconductor
12x1
8
13
6x2
Sensors