1747314-1 TE Connectivity, 1747314-1 Datasheet - Page 66

• Manufacturer Part Number: 1747314-1
• Manufacturer: TE Connectivity
• Type: SIMr

Specifications of 1747314-1

• Gender: M
• Mounting Style: Surface Mount
• Termination Method: Solder
• Body Orientation: Straight
• Contact Pitch (mm): 2.54mm
• Housing Material: Thermoplastic
• Contact Material: Phosphor Bronze
• Contact Pitch: 2.54mm
• Product Type: Connector
• Card Type: 2FF mini SIM
• Card Guide Slots: With
• Pcb Mount Style: Surface Mount
• Contact Retention: No
• Connector Stabilization Ribs: Without
• Height Above Pc Board (mm [in]): 1.96 [0.077]
• Card Stop: With
• Ejector Type: Push - Pull
• Centerline (mm [in]): 2.54 [0.100]
• Durability Rating: 5000 Cycles
• Contact Base Material: Phosphor Bronze
• Number Of Contacts: 6
• Housing Color: Black
• Ul Flammability Rating: UL 94V-0
• Card Insertion Style: Normal Insertion
• Card Detection Switch: Without
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Packaging Method: Tape & Reel
• Packaging Quantity: 1,000/Reel
• Lead Free Status / RoHS Status: Compliant

64
Products for Mobile Equipment
MID Technology
MID
Laser Direct Structuring Technology
Laser Direct Structuring (LDS) Technology
■
■
■
■
3D Part Design
Tyco Electronics provides its customers vast design expertise over a wide variety of manufac-
turing technologies. Our design engineers are experts in two shot design and product integration
for MID products. Optimal solutions are engineered with the appropriate MID technology to best
suit the application.
Modeling and Simulation
Tyco Electroniocs employs the most up
to date design tools available. We use
sophisticated 3D modeling and simulation
packages to accurately manufacture and
predict the end product.
■
■
■
■
All specifications subject to change. Consult Tyco Electronics for latest specifications.
Offers the ability to create parts with finer line width and spacing than conventional MID
processes will allow for.
The structure is molded in a standard single shot mold using one of several proprietary plastics
available.
Desired interconnect pattern is directly written on the resulting molded part and the conductive
paths are plated using industry standard methods.
The plating adheres only where the plastic has been activated by the laser.
Pro Engineer Wildfire 2.0 CAD software
Auto CAD 2005
MPA Moldflow to predict molding
behaviors
Pro Mechanica stress and thermal
analysis software
Catalog 1654270-2
Revised 8-2007