440297-3 TE Connectivity, 440297-3 Datasheet - Page 77
440297-3
Manufacturer Part Number
440297-3
Description
Manufacturer
TE Connectivity
Type
DIMM Socketr
Datasheet
1.440297-3.pdf
(116 pages)
Specifications of 440297-3
Ejector Type
Push-On Pull-Off
Gender
HDR
Mounting Style
Surface Mount
Termination Method
Solder
Body Orientation
Right Angle
Contact Pitch (mm)
1.27mm
Housing Material
Thermoplastic
Number Of Contact Rows
1
Number Of Contacts
9POS
Voltage Rating Max
5VAC
Current Rating (max)
0.5/ContactA
Contact Material
Phosphor Bronze
Operating Temp Range
-25C to 90C
Contact Pitch
0.05mm
Lead Free Status / RoHS Status
Not Compliant
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Mini SIM
Card Packaging
Tyco Electronics propose
a new Packaging for the
3
The leadframe is over moulded
with a plastic package at
dimension close to the final
Mini SIM card body.
This technology allows our
customers to work directly
on advanced product and
use their standard available
reel-to-reel equipments.
rd
Generation of SIM Cards
Products for Mobile Equipment
Mechatronic Center Niefern
Mini SIM Card Packaging
Key Features
■
■
■
■
Produced with the Standard
Tyco Electronics Technologies
■
■
■
■
All specifications subject to change. Consult Tyco Electronics for latest specifications.
Microelectronic can be made on semi final packaging, no module out cutting and embedding
operation.
Lower risk and process time improvement.
Personalisation can be realized separately on tapes, and bring together by a final operation.
No additional card body is needed, but also possibility to plug in 1
High-speed stamping
Selective plating
Laminating
Reel-to-reel over moulding
st
or 2
nd
card body generation.
Catalog 1654270-2
Revised 8-2007
75
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