TFU0603FF04000P100 Vishay, TFU0603FF04000P100 Datasheet - Page 6

• Manufacturer Part Number: TFU0603FF04000P100
• Description: Fuses 0603 4A 24V Very Quick Acting
• Manufacturer: Vishay

Specifications of TFU0603FF04000P100

• Current Rating: 4 Amps
• Voltage Rating: 24 Volts
• Fuse Size / Group: 0603
• Termination Style: SMD/SMT
• Product: Thick Film Chip Fuse
• Interrupt Rating: 35 Amps at 24 Volts
• Fuse Type: Very Fast Acting
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

TFU 0603
Vishay Beyschlag
TESTS AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
UL/CSA 248-14, Low voltage fuses - Part 14: Supplemental
Fuses
IEC 60127-4, Universal Modular Fuse Links (UMF)
For the full test schedule refer to the documents listed above.
The testing also covers most of the requirements specified
by METI and CCC.
The tests are carried out in accordance with IEC 60068 and
under standard atmospheric conditions in accordance with
IEC 60068-1, 5.3. Climatic category LCT/UCT/56 (rated
temperature range: Lower category temperature, upper
category temperature; damp heat, long term, 56 days) is
valid.
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6
TEST PROCEDURES AND REQUIREMENTS
UL/CSA
248-14
-
-
-
5.5
-
8.2.3
-
IEC 60068-2
METHOD
21 (Ue
58 (Td)
TEST
-
-
-
-
-
1
)
Endurance test acc.
Substrate bending
Interrupting rating
characteristics at
to IEC 60127-4,
current-carrying
temp.-rise and
characteristics
soldering heat
Resistance to
Verification of
IEC 60127-1,
Time/current
Time/current
temperature.
Solderability
temperature
clause 9.2.2
at elevated
clause 9.4
capacity
nominal
TEST
(DC)
For technical questions, contact:
I = 1.1 x I
(I
SnAg3Cu0.5 or SnAg3.5;
Destructive testing under
(215 ± 3) °C; (3 ± 0.3) s
(235 ± 3) °C; (2 ± 0.2) s
R
(260 ± 5) °C; (10 ± 1) s
(260 ± 5) °C; (10 ± 1) s
overcurrent conditions
/forced gas convection);
35 A at rated voltage
Solder bath method;
Solder bath method;
Solder bath method;
b) I = 1.25 x I
1.0 h on; 0.25 h off;
a) I = 1.0 x I
non-activated flux;
non-activated flux;
Reflow method 2
Thick Film Chip Fuses
23 °C; 100 times
I = 1.0 x I
PROCEDURE
Depth 3 mm;
23 °C; 1 time
(DC-current)
R
rate 1 mm/s
SnPb40;
(DC) at 70 °C; 1.0 h
1.0 h on
1 time
R
R
(DC)
R
(DC)
(DC)
Unless otherwise specified the following values apply:
Temperature: 15 °C to 35 °C
Relative humidity: 45 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar)
The components are mounted for testing on printed-circuit
boards in accordance with IEC 60127-4, unless otherwise
specified.
The requirements stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of UL 248-14 and IEC 60127-4 respectively.
However, some additional tests and a number of
improvments against those minimum requirements have
been included.
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Optical inspection with naked eye;
Good tinning (≥ 95 % covered);
Good tinning (≥ 95 % covered);
Temperature rise of hot spot
PERMISSIBLE CHANGE
At 2.0 x I
UL 248-14, clause 8.2.4
At 2.5 x I
No visible damage;
No visible damage;
No visible damage;
No visible damage;
No visible damage;
REQUIREMENTS
no visible damage
no visible damage
no visible damage
≤ 75 K acc. to
ΔR/R ≤ 15 %
ΔR/R ≤ 15 %
ΔR/R ≤ 15 %
ΔR/R ≤ 15 %
ΔR/R ≤ 15 %
R
R
, t
, t
pre-arc
pre-arc
Document Number: 28797
< 60 s
< 5 s
Revision: 26-May-10