1871602-2 TE Connectivity, 1871602-2 Datasheet - Page 65

• Manufacturer Part Number: 1871602-2
• Description: MICRO SD CONNECTOR ASSY WITH BOSS
• Manufacturer: TE Connectivity
• Type: Micro SD Cardr

Specifications of 1871602-2

• Ejector Type: Push-On Push-Off
• Gender: HDR
• Mounting Style: Surface Mount
• Termination Method: Solder
• Body Orientation: Right Angle
• Housing Material: Thermoplastic
• Number Of Contact Rows: 1
• Number Of Contacts: 8POS
• Voltage Rating Max: 100VAC
• Current Rating (max): 0.5/ContactA
• Contact Material: Copper Alloy
• Operating Temp Range: -25C to 90C
• Insertion Force: 40
• Product Length (mm): 14.6mm
• Mount Angle: Right Angle
• Pcb Mount Style: Surface Mount
• Holddowns: With
• Solder Tail Contact Plating: Tin
• Polarizing Post Length (mm [in]): 0.45 [0.018]
• Lead Type: Surface Mount - Inline leads
• Contact Plating, Mating Area, Material: Gold
• Contact Base Material: Copper Alloy
• Housing Color: Black
• Ul Flammability Rating: UL 94V-0
• Operating Function: Push-On Push-Off
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Format: Micro Secure Digital Card
• Packaging Method: Tape & Reel
• Lead Free Status / RoHS Status: Compliant

MID Technology
at Tyco Electronics
Tyco Electronics prides itself
in being the global leader in
providing Molded Interconnect
Technology (MID). In it’s most
basic form, MID technology
can be defined as any product
that results in selectively plated
plastic parts. This technology
can be used in three basic
ways, to solve 3-dimensional
electro-mechanical problems,
for shielding purposes, or to
develop antennas.
MID Technologies
Tyco Electronics can manu-
facture MID parts using three
manufacturing technologies,
Two Shot, Laser Imaging, and
Laser Direct Structuring.
Products for Mobile Equipment
MID Technology
MID
Two Shot MID Technology
Two Shot
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Laser Imaging MID Technology
Laser Imaging today is typically only used for rapid prototyping
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All specifications subject to change. Consult Tyco Electronics for latest specifications.
Sequential injection molded substrate
A plateable resin and a non-plateable resin
Imaging in the molding process
All electroless plating of catalyzed surfaces
Manufacturing using a circuit board production type process
Machine or single shot mold in 3–10 days
Laser image circuitry in 3–5 days
Circuitry and plating are accurate to production processes
Catalog 1654270-2
Revised 8-2007
63