EZA-NCE470M Panasonic, EZA-NCE470M Datasheet - Page 5

• Manufacturer Part Number: EZA-NCE470M
• Description: Resistor Networks & Arrays Thick Film 4 Cap Array 3 Term 1608
• Manufacturer: Panasonic
• Type: Filmr

Specifications of EZA-NCE470M

• Capacitance: 47pF
• No. Of Capacitors: 4
• Tolerance (+ Or -): 20%
• Voltage: 25VDC
• Number Of Terminals: 10Terminal
• Operating Temp Range: -25C to 85C
• Mounting Style: Surface Mount
• Package / Case: 2512
• Construction: SMT Chip
• Failure Rate: Not Required
• Product Height (mm): 0.75mm
• Product Depth (mm): 3.1mm
• Product Length (mm): 6.4mm
• Lead Diameter (nom): Not Requiredmm
• Terminal Pitch: 1.27mm
• Product Type: Networks
• Lead Free Status / RoHS Status: Compliant

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Recommendations and precautions are described below.
The following are precautions for individual prod ucts. Please also refer to the precautions common to EMI Filters,
Fuses, and Sensors(MR Elements) shown on page EX2 of this catalog.
1. Take measures against mechanical stress during and after mounting of Chip 3-Terminal Capacitor Array (hereafter
2. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the capacitors arrays'
3. When soldering with a soldering iron, never touch the capacitor arrays' bodies with the tip of the soldering iron. When
4. As the amount of applied solder becomes larger, the mechanical stress applied to the capacitor arrays increases,
5. Do not apply shock to the capacitor arrays or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the
6. Avoid excessive bending of printed circuit boards in order to protect the capacitor arrays from ab nor mal stress.
7. The static capacitance may decrease by a few percent from the time of shipment due to the char ac ter is tics peculiar to
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Safety Precautions
Recommended Soldering Conditions
● Recommended soldering conditions for refl ow
● Flow Soldering
called the capacitor arrays) so as not to damage their electrodes and pro tec tive coat ings.
Be careful not to misplace the capacitor arrays on the land patterns. Otherwise, solder bridging may occur.
per for mance and/or reliability.
using a soldering iron with a high temperature tip, fi nish soldering as quickly as possible (within three seconds at 350 °
C max.).
causing problems such as cracks and faulty characteristics. Avoid applying an excessive amounts of solder.
capacitor arrays' protective coatings and bodies may be chipped, af fect ing their per for mance.
dielectric materials having a high dielectric constant.
·Refl ow soldering shall be performed a maximum of
·Please contact us for additional information when
·Please measure the temperature of the terminals and
two times.
used in conditions other than those specifi ed.
study every kind of solder and printed circuit board
for solderability before actual use.
We do not recommend flow soldering to the Chip 3-Terminal Capacitor Array: EZASC, because solder
bridging may occur due to the narrow 0.8 mm pitch of EZASC. Please contact us regarding flow soldering
of EZANC type.
Preheating
Peak
Time
Heating
For soldering (Example : Sn/Pb)
For lead-free soldering (Example : Sn/Ag/Cu)
Preheating
Main heating
Peak
Preheating
Main heating
Peak
Chip 3-Terminal Capacitor Array
140 °C to 160 °C
150 °C to 180 °C
Above 200 °C
Above 230 °C
Temperature
Temperature
max. 260 °C
235 ± 5 °C
60 s to 120 s
60 s to 120 s
30 s to 40 s
30 s to 40 s
max. 10 s
max. 10 s
Time
Time
Feb. 2006