ATA556714-DDT Atmel, ATA556714-DDT Datasheet - Page 27

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ATA556714-DDT

Manufacturer Part Number
ATA556714-DDT
Description
RF Wireless Misc 125 kHz (330bit r/w 75pF)
Manufacturer
Atmel
Datasheet
9. Ordering Information
9.1
9.2
4874F–RFID–07/08
Note:
ATA5567
ATA556711
ATA556715
Ordering Examples
Available Order Codes
1. For available order codes, contact your local Atmel Sales/Marketing office.
a b
- x x x
- x x x
- x x x
ATA556714N-DDB
ATA556711N-DDT 1
ATA556711N-DDB
ATA556714N-DDB
ATA556715-PAE
ATA556711-TASY
New order codes will be created by customer request if order quantities are over 250k pieces.
- DDW
- DDT 1
- DDB
11N
14N
01N
- TASY
- PAE
Package
Package
Package
(1)
- Die on wafer, 6” unsawn wafer, thickness 300 µm
- Die in tray (waffle pack), thickness 300 µm
- Die on foil, 6” sawn wafer with ring, thickness 150 µm
- 2 pads without on-chip capacitor
- 4 pads with on-chip 75 pF capacitor
- 2 pads without capacitor, damping during initialization
- SO8 package (lead-free)
- NOA3 micromodule (lead-free)
(on request)
Tested die on sawn 6” wafer on foil with ring, thickness 150 µm, 75 pF
on-chip capacitor, no damping during POR initialization; especially for
ISO 11784/785 and access control applications
Drawing
Figure 10-3 on page 30
Figure 10-1 on page 28
Figure 10-2 on page 29
Figure 10-1 on page 28
Drawing
Figure 10-7 on page 34
Drawing
Figure 10-5 on page 32
Figure 10-6 on page 33
ATA5567
and
27

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