ATA559001-DDT Atmel, ATA559001-DDT Datasheet - Page 102

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ATA559001-DDT

Manufacturer Part Number
ATA559001-DDT
Description
RF Wireless Misc UHF (1kbit r/w anti-collision)
Manufacturer
Atmel
Datasheet
17. Ordering Information
18. Package Information
Figure 18-1. TSSOP10 Package
102
Extended Type Number
ATA559001-DBB
ATA559001-DDW
ATA559001-6DQY
ATA5590
Package: TSSOP 10
(acc. to JEDEC Standard MO-187)
Dimensions in mm
Not indicated tolerances ± 0.05
4 x 0.5 = 2 nom.
0.5 nom.
Package
6” Wafer
6” Wafer
TSSOP10
10
1
9
2
3
±0.1
8 7 6
3 4 5
0.25
Remarks
25 µm NiAu bumps, 150 µm wafer thickness, sawn on foil,
sample delivery, die in tray (DBT)
300 µm thickness, not sawn
Taped and reeled, Pb-free
Drawing-No.: 6.543-5095.01-4
Issue: 3; 16.09.05
technical drawings
according to DIN
specifications
3.8
4.9
3
±0.1
±0.3
±0.1
(Figure
(Figure 18-2 on page
(Figure 18-2 on page
18-1)
4817C–RFID–03/07
103)
103)

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