TGA2923-SG-T/R TriQuint, TGA2923-SG-T/R Datasheet - Page 12

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TGA2923-SG-T/R

Manufacturer Part Number
TGA2923-SG-T/R
Description
RF Amplifier 10W 3.5 GHz HPA
Manufacturer
TriQuint
Datasheet

Specifications of TGA2923-SG-T/R

Operating Frequency
3.5 GHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
1061587
Proper ESD precautions must be followed while handling packages.
Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry.
TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow oven
vendors’ recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed
in the table below.
Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot placement.
The volume of solder paste depends on PCB and component layout and should be well controlled to
ensure consistent mechanical and electrical performance.
Clean the assembly with alcohol.
Time above Melting Point
Time within 5 °C of Peak
Max Peak Temperature
Activation Time and
Reflow Profile
Ramp-down Rate
Ramp-up Rate
Temperature
Temperature
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
Recommended Surface Mount Package Assembly
TGA2923-SG
Part
Typical Solder Reflow Profiles
60 – 120 sec @ 140 – 160 °C
Ordering Information
May 2009 © Rev -
60 – 150 sec
4 – 6 °C/sec
Gull Wing Leads
10 – 20 sec
3 °C/sec
240 °C
SnPb
Package Style
60 – 180 sec @ 150 – 200 °C
TGA2923-SG
60 – 150 sec
4 – 6 °C/sec
10 – 20 sec
Pb Free
3 °C/sec
260 °C
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