MAX2027EUP-D Maxim Integrated Products, MAX2027EUP-D Datasheet - Page 8

• Manufacturer Part Number: MAX2027EUP-D
• Description: RF Amplifier 50MHz to 400MHz Digi tally Controlled Var
• Manufacturer: Maxim Integrated Products
• Type: Gain Amplifierr

Specifications of MAX2027EUP-D

• Operating Frequency: 400 MHz
• Noise Figure: 4.7 dB at 50 MHz
• Supply Current: 60 mA
• Maximum Power Dissipation: 1700 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: TSSOP EP
• Minimum Operating Temperature: - 40 C
• Number Of Channels: 1 Channel

IF Digitally Controlled Variable-Gain Amplifier
Figure 1. Typical Application Circuit
The MAX2027 integrates a fixed-gain amplifier in a neg-
ative feedback topology. This fixed-gain amplifier is
optimized for a frequency range of operation from
50MHz to 400MHz with a high-output third-order inter-
cept point (OIP3). The bias current is chosen to opti-
mize the IP
current consumption is 60mA while exhibiting a typical
35dBm output IP
The fixed-gain amplifier output port requires an external
pullup choke inductor to V
bias inductor of 330nH from AMP
(pin 14). At the output, connect a 680nH choke inductor
from RF_OUT (pin 12) to V
current to the amplifier.
A properly designed PC board is an essential part of
any RF/microwave circuit. Keep RF signal lines as short
as possible to reduce losses, radiation, and induc-
8
_______________________________________________________________________________________
*OPTIONAL COMPONENTS: USE TO IMPROVE HIGHER FREQUENCY MATCHING
RF IN
3
C
of the amplifier. When R
1
C
3
8
*
.
CONTROL
INPUTS
V
CC
Layout Considerations
CC
CC
Fixed-Gain Amplifier
. At the input, connect a
R
(pin 11) to provide bias
6
V
L
R
3
CC
IN
Choke Inductor
*
5
(pin 15) to I
C
R
7
4
1
is 825Ω, the
R
3
R
2
C
2
BIAS
B4
B3
B2
B1
B0
10
1
2
3
4
5
6
7
8
9
ATTENUATION
tance. For the best performance, route the ground pin
traces directly to the exposed pad under the package.
The PC board exposed pad must be connected to the
ground plane of the PC board. It is suggested that multi-
ple vias be used to connect this pad to the lower level
ground planes. This method provides a good RF/thermal
conduction path for the device. Solder the exposed pad
on the bottom of the device package to the PC board.
The MAX2027 Evaluation Kit can be used as a refer-
ence for board layout. Gerber files are available upon
request at www.maxim-ic.com.
Proper voltage-supply bypassing is essential for high-
frequency circuit stability. Bypass each V
0.1µF and 100pF capacitor. Connect the 100pF capacitor
as close to V
The exposed paddle (EP) of the MAX2027’s 20-pin
TSSOP-EP package provides a low thermal-resistance
path to the die. It is important that the PC board on
CONTROL
LOGIC
Exposed Pad RF/Thermal Considerations
MAX2027
EXPOSED
PADDLE
AMP
BIAS
CC
pins as possible.
20
19
18
17
16
15
14
13
12
11
ATTN
AMP
I
I
BIAS
SET
OUT
IN
Power-Supply Bypassing
R
1
L
4
*
C
C
5
3
L
L
2
1
C
9
C
*
4
C
6
CC
C
10
RF OUT
V
CC
pin with a