TGC4403-SM TriQuint, TGC4403-SM Datasheet - Page 12

• Manufacturer Part Number: TGC4403-SM
• Description: RF Wireless Misc 8 - 15GHz Doubler w/Amplifier
• Manufacturer: TriQuint

Specifications of TGC4403-SM

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1079050

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Recommended Surface Mount Package Assembly
Time within 5 °C of Peak Temperature
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Activation Time and Temperature
Proper ESD precautions must be followed while handling packages.
Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry.
TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow
oven vendors’ recommendations when developing a solder reflow profile. Typical solder reflow profiles
are listed in the table below.
Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot
placement. The volume of solder paste depends on PCB and component layout and should be well
controlled to ensure consistent mechanical and electrical performance.
Clean the assembly with alcohol.
Time above Melting Point
Max Peak Temperature
Reflow Profile
Ramp-down Rate
Ramp-up Rate
TriQuint Semiconductor: www. triquint.com [phone] Fax [phone] [e-mail]
Typical Solder Reflow Profiles
TGC4403-SM
Ordering Information
Part
Assembly Notes
60 – 120 sec @ 140 – 160 °C
Mar 2007 © Rev -
60 – 150 sec
4 – 6 °C/sec
10 – 20 sec
3 °C/sec
QFN 4x4 Surface Mount
SnPb
240 °C
Package Style
60 – 180 sec @ 150 – 200 °C
TGC4403-SM
60 – 150 sec
4 – 6 °C/sec
10 – 20 sec
Pb Free
3 °C/sec
260 °C
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